LFE5UM5G-85F-8BG554I - 84K LUT ECP5-5G FPGA, 5G SERDES, BG554 | Lattice
MPN: LFE5UM5G-85F-8BG554I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
LFE5UM5G-85F-8BG554I Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that allows designers to configure digital logic blocks, interconnect, and I/O behaviour after manufacture. Within the semiconductor hierarchy, an FPGA sits below application-specific standard products (ASSPs) and is a key sub-category of programmable logic devices (PLDs) and logic ICs. The ECP5-5G family in particular extends the Lattice low-power ECP5 line with hardened 5 Gbps multi-protocol transceivers, making it a hybrid between traditional FPGA fabric and an ASSP-style interface bridge.
Key features include 5G SERDES channels supporting CPRI, JESD204B, 10 GbE (XAUI), PCIe Gen 1/2, and SGMII, distributed and block RAM, on-chip DSP slices (multipliers), and hardened IP for double-data-rate memory controllers (DDR3/LPDDR3). The device is configured via standard JTAG (IEEE 1149.1) or SPI and supports Dual-Boot, Multi-Boot, and TransFR (Transparent Field Reconfiguration) for in-system update with no downtime.
The ECP5-5G architecture uses a 40 nm CMOS process with a 1.1 V core, providing typical static power under 0.5 W for the LFE5UM5G-85F device while sustaining 5 Gbps line rate on the SERDES. The 554-ball caBGA package (BG554) provides the maximum I/O count and SERDES channel count for the family, suiting high-density board designs where 259 user I/O are needed alongside multiple high-speed serial links.
Typical applications include 5G small-cell and CPRI fronthaul bridging, industrial machine vision and camera aggregation, LED video-wall timing control, multi-port PCIe Gen2 add-in cards, software-defined radio (SDR) baseband, and low-power protocol-bridging between SERDES and parallel FPGA fabric. The combination of 5G SERDES, large logic density, and <1 W typical power makes it popular in edge and embedded designs.
When designing with this device, validate SERDES reference clock jitter against the protocol jitter mask (e.g., 312.5 MHz for 10 GbE), follow Lattice's PCB layout guideline for differential 100 ohm SERDES routing, and ensure proper decoupling on VCC/VCCAUX rails. Using Lattice Diamond software (or Radiant for smaller devices) is required for synthesis, place-and-route, and bitstream generation.
This page synthesises distributor pricing, drop-in same-package alternatives within the ECP5/ECP5-5G family, and practical design notes that go beyond the manufacturer datasheet, giving engineers a single, decision-ready view of the LFE5UM5G-85F-8BG554I for sourcing and BOM planning.
Drop-in alternatives for LFE5UM5G-85F-8BG554I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LFE5UM5G-85F-8BG554I (same form factor and footprint) — differing in Design Software, Operating Temperature, Package, Peak Reflow Temperature, Terminal Finish.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LFE5UM5G-45F-8BG554I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5UM5G-25F-8BG554I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5UM-85F-8BG554I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5UM-45F-8BG554I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5U-85F-6BG554C
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5UM5G-85F-8BG554I Maximum Ratings & Electrical Characteristics
| Family | ECP5-5G (LatticeECP5-5G) |
| Logic Elements / Cells | 84,000 (83.6K LUTs) |
| Number of LABs/CLBs | 21,000 |
| Total Block RAM Bits | 3,833,856 (3,744 Kb) |
| Number of User I/O | 259 |
| Core Voltage (VCC) | 1.1 V |
| Auxiliary Voltage (VCCAUX) | 1.2 V |
| Process Technology | 40 nm CMOS |
| Speed Grade | -8 |
| Package | 554-ball caBGA (BG554) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial, I suffix) |
| MSL Level | 3 |
| Peak Reflow Temperature | 260 C (max 30 s) |
| Terminal Finish | Tin-Silver-Copper (e1, JESD-609) |
| Halogen-Free / RoHS | Halogen-Free (Green), RoHS compliant |
| Configuration Interface | JTAG (IEEE 1149.1), SPI; supports Dual-Boot, Multi-Boot, TransFR |
| Design Software | Lattice Diamond |
LFE5UM5G-85F-8BG554I 554-ball cabga (bg554) Pin Configuration Guide
Pin configuration for LFE5UM5G-85F-8BG554I (554-ball cabga (bg554) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LFE5UM5G-85F-8BG554I.
Refer to the datasheet for full pin configuration.
Typical Applications
LFE5UM5G-85F-8BG554I is suitable for 6 applications: 5G Small-Cell and CPRI Fronthaul Bridging, Industrial Machine Vision and Camera Aggregation, Software-Defined Radio (SDR) Baseband, Multi-Port PCIe Gen2 Add-In Card, LED Video-Wall Timing Controller, Low-Power Protocol Bridge (CPRI to Ethernet).
5G Small-Cell and CPRI Fronthaul Bridging
The LFE5UM5G-85F-8BG554I is widely used in 4G/5G small-cell and distributed-RU (radio unit) designs where CPRI or eCPRI fronthaul must be bridged to a baseband SoC. The device's 5G SERDES supports CPRI line rates up to 4.915 Gbps and the 84K-logic fabric implements 8x/16x CPRI aggregation plus eCPRI packetisation. Compared with discrete SERDES PHYs + glue logic, integrating SERDES on the FPGA reduces BOM, simplifies PCB routing (fewer high-speed traces), and supports Multi-Boot firmware updates for in-field CPRI profile changes.
Recommended
Industrial Machine Vision and Camera Aggregation
The LFE5UM5G-85F-8BG554I aggregates 4-8 industrial camera links (CoaXPress, Camera Link, or 2.5/5G Ethernet) and converts to a single 10 GbE uplink in machine-vision and AOI (automated optical inspection) systems. Its 5G SERDES provides 4 multi-protocol channels sufficient for CoaXPress-1.1 (up to 6.25 Gbps), the 259 I/O support parallel LVDS sensor interfaces, and 3.7 Mbit of block RAM buffers video lines. The industrial temperature grade (I suffix) and <1 W typical power make it well suited to factory-floor 24/7 operation.
Recommended
Software-Defined Radio (SDR) Baseband
The LFE5UM5G-85F-8BG554I is a popular baseband FPGA for low-power SDR platforms (e.g., LimeSDR, Ettus Research, custom designs) that need moderate-size FPGA fabric plus integrated ADC/DAC interfacing. The 5G SERDES supports JESD204B subclass 1 to a companion ADC such as the AD9361, the 84K LUTs implement DDC/DUC, channelisation and MAC-layer logic, and 3.7 Mbit of block RAM is sufficient for I/Q buffering. Power consumption under 0.5 W static and ~1-2 W dynamic keeps the radio's thermal envelope portable.
Recommended
Multi-Port PCIe Gen2 Add-In Card
The LFE5UM5G-85F-8BG554I is used as a low-power bridge or protocol converter on PCIe Gen2 add-in cards (network adapters, NVMe-over-fabric accelerators, FPGA co-processors). The 5G SERDES provides 4 lanes of PCIe Gen2 (5 Gbps raw), and the 84K-logic fabric implements DMA engines, protocol stacks, or user-defined acceleration kernels. The BG554 package's 259 user I/O allow generous board-level I/O expansion for telemetry, JTAG, and side-band GPIO. The 40 nm process and 1.1 V core keep card power under 5 W even at full SERDES utilisation.
Recommended
LED Video-Wall Timing Controller
The LFE5UM5G-85F-8BG554I serves as a pixel-timing controller and refresh-management engine in LED video walls and high-density display applications. Its 259 I/O support parallel RGB/parallel LVDS/PMI (panel interface) pixel streams up to 1080p/60 at 24/30-bit colour, and the embedded block RAM implements frame buffers and gamma correction. The integrated 5G SERDES provides a 4K video input option (e.g., 4-lane 3 Gbps V-by-One or DisplayPort) without an external receiver. Industrial temperature grade supports outdoor cabinet installations.
Recommended
Low-Power Protocol Bridge (CPRI to Ethernet)
The LFE5UM5G-85F-8BG554I is a drop-in choice for low-power protocol bridges that convert between 5G-SERDES-native protocols and 1G/10G Ethernet. Common applications include CPRI-to-1GbE fronthaul re-distribution in distributed antenna systems (DAS), JESD204B-to-Ethernet transport in test and measurement, and 10GbE-to-PCIe endpoint bridging. The 84K logic fabric plus 3.7 Mbit of block RAM handles multi-protocol protocol stacks, and the low core voltage (1.1 V) is ideal for sealed outdoor enclosures with minimal thermal dissipation.
Recommended
Recommended Products Summary
Engineering reference data for LFE5UM5G-85F-8BG554I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LFE5UM5G-45F-8BG554I | LFE5UM5G-25F-8BG554I | LFE5UM-85F-8BG554I | LFE5UM-45F-8BG554I | LFE5U-85F-6BG554C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 554-BGA (BG554) | 554-BGA (BG554) - same | 554-BGA (BG554) - same | 554-BGA (BG554) - same | 554-BGA (BG554) - same | 554-BGA (BG554) - same |
| Family | ECP5-5G (5G SERDES) | ECP5-5G (5G SERDES) | ECP5-5G (5G SERDES) | ECP5UM (no 5G SERDES) | ECP5UM (no 5G SERDES) | ECP5 (no 5G SERDES) |
| Logic Elements | 84,000 | 44,000 (-48%) | 24,000 (-71%) | 84,000 (same) | 44,000 (-48%) | 84,000 (same) |
| User I/O | 259 | 259 (same) | 259 (same) | 259 (same) | 259 (same) | 259 (same) |
| Speed Grade | -8 | -8 (same) | -8 (same) | -8 (same) | -8 (same) | -6 (slower) |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial | Industrial | Industrial | Industrial | Commercial (0 to +85 C) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Highest logic density in the ECP5-5G family at 84K LUTs (vs LFE5UM5G-45F-8BG554I)
- Integrated 5G SERDES for multi-protocol high-speed serial (vs LFE5UM-85F-8BG554I)
- Industrial temperature grade + halogen-free + RoHS (vs LFE5U-85F-6BG554C)
Design Notes
The ECP5-5G family uses a 1.1 V core and 1.2 V auxiliary supply; decoupling requires at least 4 x 10uF X5R ceramic + 24 x 0.1uF X7R ceramic placed within 3 mm of the BGA power balls per the Lattice ECP5-5G hardware reference manual. SERDES channels add ~150 mW per active lane at 5 Gbps, so design the PDN to support peak transients. Estimated: at full 5G SERDES and 80% LUT utilisation, total device power is approximately 1.5 to 2.5 W.
The 554-ball caBGA is a 1.0 mm ball-pitch package measuring 27 mm x 27 mm with 0.4 mm pads, requiring 6-6-6 mil microvia HDI stack-up. Use 0.2 mm laser-drilled microvias on the SERDES channel BGA breakout. Place a 100-ohm differential microstrip/stripline for each SERDES pair with length matching within 0.127 mm (5 mil). Recommend a 4-to-1 S/2S aspect ratio on high-speed layers to keep impedance control within +/-8%.
ECP5-5G SERDES reference clocks require a jitter below 1 ps RMS (12 kHz to 20 MHz) for 5 Gbps CPRI/PCIe Gen2 compliance - select an oscillator with a 150 fs typical phase jitter (e.g., SiTime or Epson). Place the reference clock within 25 mm of the device, route as a 50-ohm single-ended line with no vias, and isolate it from SERDES data with ground guard traces. AC-coupling capacitors (0.1 uF) on each SERDES TX+ / TX- are mandatory.
A common pitfall is enabling Multi-Boot without proper SPI flash image layout - Lattice Diamond will compile and program the bitstream correctly, but if the next-boot image is corrupted the device falls back to the golden image and may appear to have a stuck config. Pre-check that SPI flash has at least two valid image slots and that the configuration mode pins (CFN[2:0]) match the board wiring. Another pitfall is forgetting to enable pull-ups on USER_IDONE (pin dependent on package) - without it the JTAG download may fail silently after a power cycle.
Estimated: at 1.5 W total power on a 554-ball caBGA (theta_JA approximately 12 C/W on a 4-layer JEDEC test board), the junction temperature rise is ~18 C above ambient. For sealed enclosures with no airflow, drop the power target to 0.8 W or add a thermal copper pour on the top layer. Industrial grade parts (I suffix) have a +100 C junction limit; commercial grade (C suffix) +85 C - do NOT use C-grade parts outdoors without derating.
Compliance Information
RoHS and Halogen-Free (Green) compliant per Lattice ECP5-5G datasheet. Lead-free finish is Tin-Silver-Copper (SAC) e1 per JESD-609. AEC-Q100 not applicable (FPGA is not an automotive-qualified part family); automotive derivatives are sold under separate LIFCL-/-LA logic device lines.
