FPGA & CPLD
Products (6,800+)
XC6SLX16-2FTG256C - Spartan-6 LX FPGA, 14K Cells, 256-BGA
The AMD (Xilinx) XC6SLX16-2FTG256C is a member of the Spartan-6 LX family of field-programmable gate arrays (FPGAs) providing 14,579 logic cells (approximately 1,139 CLBs), 589,824 bits of block RAM, and 186 maximum user I/Os in a 256-ball fine-pitch thin BGA (FTG256) package. Built on a 45 nm CMOS process, the LX variant targets low-cost, high-volume applications with an emphasis on logic density and embedded memory, while delivering typical core performance up to 667 MHz. FPGAs are programmable logic devices that allow hardware designers to implement arbitrary digital circuits, ranging from glue logic and bus bridges to full processor subsystems and DSP pipelines. The Spartan-6 LX series specifically targets cost-sensitive, high-volume designs such as consumer electronics, industrial control, automotive infotainment, and communications infrastructure. Within the broader taxonomy, FPGAs sit alongside CPLDs (less-dense, non-volatile), ASICs (fixed-function, high-volume), and microcontrollers (software-programmed sequential); FPGAs uniquely offer hardware-level parallelism with reconfigurable logic. Key features of the XC6SLX16 include the 256-ball FTG256 package at 1.0 mm ball pitch, a 17×17 mm body, lead-free/RoHS-compliant construction, and an industrial-class (-2) speed grade. The device integrates dual 10/100/1000 Ethernet MACs, dedicated DSP slices (32 of them, totaling 8.18 GMAC/s when fully packed), and 32 BRAM blocks supporting 18 Kb each. Configuration is supported through JTAG (IEEE 1149.1/1532), SPI (x1, x2, x4), and BPI (x8, x16) modes, while clock management is handled by up to 4 clock management tiles (CMTs) containing mixed-mode clock managers and PLLs. Typical applications include high-volume bridging between legacy video or memory interfaces and modern SoCs, motor control loops, low-cost industrial Ethernet endpoints, video processing pipelines, and embedded soft-processor cores such as MicroBlaze or PicoBlaze. Designers frequently pair the Spartan-6 LX with companion DDR memory controllers and high-speed serial transceivers (where required by the chosen package). A critical design consideration with the XC6SLX16-2FTG256C is its lifecycle status: the Spartan-6 family is generally considered NRND (Not Recommended for New Designs) per AMD/Xilinx's product longevity notice. Engineers building production hardware should evaluate Artix-7 or Spartan-7 successors for new projects while keeping this part viable for maintenance of legacy designs. Power decoupling, multi-bank I/O voltage referencing, and bitstream encryption (AES-256) also require careful PCB and firmware planning. This page synthesizes authorized distributor pricing, same-package drop-in alternatives, and practical hardware-design guidance that goes beyond the datasheet's typical-application notes — including lifecycle awareness for engineers managing long-life industrial installations.
XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD
The AMD XC6SLX16-2FTG256I is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 1,139 CLBs, 186 I/Os, and a stated internal frequency of 667 MHz, packaged in a 256-pin lead-free FTGBGA. The -2 speed grade and I temperature designation identify this device as an industrial-oriented Spartan-6 LX option for cost-sensitive embedded systems requiring substantial programmable logic, dedicated block RAM, DSP resources, and clock-management capability. A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing blocks are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and integrates configurable logic, fixed or block memory, DSP processing, clock management, and programmable I/O. This integration allows one package to replace combinations of processors, interface controllers, data converters, and discrete programmable logic while preserving upgradeability through a configuration bitstream. Key resources include 2,278 adaptive logic modules, 186 user I/Os, 14,579 logic cells, and 1,139 CLBs. The source data also identifies 375 MHz as another stated frequency and gives a core-voltage range of 1.14 V to 1.26 V. The FTG256 package uses a 17 mm by 17 mm body with a 1 mm ball pitch, supporting dense PCB integration without requiring a large leaded package. The Spartan-6 LX architecture combines programmable logic with block RAM, DSP slices, digital clock managers, and PLLs. Those resources allow parallel data-path designs, protocol bridging, control-plane logic, and fixed-point signal processing to share one FPGA. A 667 MHz stated internal frequency supports demanding clock domains, but achievable system performance remains dependent on the selected design, timing constraints, memory interface implementation, and I/O standards. Typical uses include industrial control and automation, embedded communications gateways, video and image-processing pipelines, instrumentation, and low-cost data-acquisition systems. In these applications, the 186 I/Os provide connectivity, while the 14,579 logic cells allow control logic and datapaths to be consolidated. The Spartan-6 family is particularly relevant to designs that require FPGA flexibility without moving to a larger or more expensive device family. Designers should use the official Spartan-6 package pinout files for every FTG256 ball assignment and verify the selected bank supplies, configuration pins, clock-capable pins, and I/O standards against the design constraints. PCB layout must also account for the 1 mm pitch, power and ground distribution, configuration-boot behavior, and high-speed routing required by the implemented interfaces. This page consolidates the verified specifications, distributor pricing, same-footprint alternatives, and application-oriented design guidance available for the XC6SLX16-2FTG256I. It also distinguishes documented values from unresolved lifecycle, pin-level, and pricing details so engineers can make a traceable sourcing decision.
XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD
The AMD (Xilinx) XC6SLX16-3CPG196C is a Spartan-6 LX family Field Programmable Gate Array delivering 14,579 cells, 1,451 Kbits of block RAM, and 106 user I/O in a 196-ball CSBGA (0.5 mm pitch, 8x8 mm) package. The device operates at the -3 speed grade, the highest performance bin in the Spartan-6 LX series, with a maximum internal clock frequency of 667 MHz and 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock managers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the digital-logic hierarchy: they deliver ASIC-level performance and parallelism while remaining reprogrammable in the field. The Spartan-6 family specifically targets cost-sensitive, high-volume applications where power consumption, density, and price-per-logic-cell are critical. Key features of the XC6SLX16-3CPG196C include 14,579 logic cells, 1,451 Kbits of block RAM (576 Kbits dual-port), 32 DSP48A1 slices, 2 clock management tiles (CMTs), and 2 PCIe hard IP blocks. The 106 available user I/Os support multiple I/O standards including LVCMOS, LVDS, and LVTTL at programmable slew rates and strengths. The CSBGA-196 package (8x8 mm body, 0.5 mm ball pitch) suits compact, high-density PCB layouts. The Spartan-6 LX architecture is built on a 45 nm CMOS process and provides lower static and dynamic power than the prior Spartan-3A generation. The device integrates a hard PCIe endpoint block (1-lane Gen1), hard memory controllers for DDR/DDR2/DDR3/LPDDR, and a high-speed GTP serial transceiver-free design (the LX family omits transceivers, unlike the LXT). The -3 speed grade delivers the highest Fmax in the family. Typical applications include industrial motor and motion control, video surveillance and image processing, low-cost PCIe endpoint cards, consumer display controllers, and embedded DSP systems. The CSBGA-196 footprint is particularly suitable for space-constrained designs such as portable test equipment and 4-layer FR4 carrier boards. The 45 nm process and 1.2 V core reduce thermal dissipation compared to older 90 nm and 65 nm FPGA families. When designing with this device, allocate sufficient decoupling capacitance (typically 100 nF and 4.7 uF combinations) at each supply pin and follow AMD's Spartan-6 PCB Design Guide for controlled-impedance routing. The 0.5 mm pitch CSBGA requires via-in-pad or laser-drilled microvia technology on standard 4-layer boards; ensure your PCB fabrication process supports the pitch before committing to layout.
XC6SLX16-3CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD
The AMD XC6SLX16-3CSG324C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 232 I/O, 589,824 RAM bits, and a 667 MHz internal frequency, packaged in a 324-CSPBGA. The -3 designation identifies the highest-performance Spartan-6 speed grade in the provided source data, while the C suffix denotes the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated processing resources on one device. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic class and provides a hardware alternative to combining numerous discrete logic devices. It is widely used when design changes, parallel processing, high I/O density, or rapid product customization are more important than the lowest unit cost. The XC6SLX16 offers 14,579 logic cells organized into 1,139 LABs and CLBs, together with 589,824 bits of embedded block RAM. Its 232 user I/O support communication links, control interfaces, memory connections, and mixed-signal system integration. The 667 MHz internal frequency provides a concrete timing reference for clocked digital designs, although achievable system performance depends on the selected tools, constraints, memory interfaces, and I/O standards. This device is built on a 45 nm FPGA process and supports operating supply voltages from 1.14 V to 1.26 V. The 324-CSPBGA package supports dense surface-mount assembly while exposing a substantial pin count for high-bandwidth designs. The commercial-grade part is specified for a 0 °C to 85 °C operating range, making it appropriate for cost-sensitive equipment operating in controlled commercial environments rather than extended industrial temperature conditions. Typical uses include real-time digital signal processing, video encoding and decoding, image processing, image enhancement, industrial automation, programmable control, and high-performance computing accelerators. Its combination of logic, memory, and 232 I/O permits a complete parallel pipeline to be consolidated into one FPGA. Dedicated block RAM can buffer video lines or sample data, while programmable logic can implement filters, protocol converters, and control algorithms. Designers should obtain the AMD Spartan-6 package pinout file before assigning any board-level pins and verify the selected package, voltage requirements, and pinout against the device documentation. The provided search results conflict on package dimensions, so the exact body size and ball-pitch information must be checked in the authoritative package drawing rather than inferred from third-party listings. Commercial-temperature operation should also be confirmed against the enclosure temperature. This product page consolidates the verified distributor specifications, price, source links, package identity, and same-family drop-in options into an engineering-focused reference. It also distinguishes documented facts from unavailable details, helping teams compare sourcing options while avoiding unsupported package, pinout, or timing assumptions.
XC6SLX16-3FT256C - 14,579 Logic Cell Spartan-6 FPGA | AMD
AMD XC6SLX16-3FT256C is a Spartan-6 LX field-programmable gate array with 14,579 logic elements, 1,139 configurable logic blocks, 589,824 bits of block RAM, and a maximum clock frequency of 667 MHz, packaged in a 256-LBGA. The device combines programmable logic, embedded memory, programmable I/O, and dedicated FPGA resources in a single 45 nm CMOS device for embedded and cost-sensitive digital systems. A field-programmable gate array is a semiconductor whose digital logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy and provides parallel programmable logic, block RAM, digital signal processing resources, and clock-management functions. This makes the device useful where a fixed application-specific integrated circuit would be inflexible or uneconomic to develop. The XC6SLX16-3FT256C provides 14,579 logic elements arranged across 1,139 CLBs, with 589,824 total RAM bits supporting data buffering, packet handling, and general-purpose embedded storage. Its reported 667 MHz maximum clock frequency provides useful timing margin for control logic, interface bridges, instrumentation, and embedded processors. The -3 speed designation identifies its performance grade within the Spartan-6 LX family. Built on 45 nm CMOS technology, the device supports a 1.2 V core supply as identified in the verified product records. Its 256-LBGA package uses a 1 mm pitch and measures approximately 17 mm by 17 mm. The supplied comparison data also identifies 186 I/O resources, allowing the device to interface multiple buses, peripherals, and external control signals while preserving a compact surface-mount footprint. Typical uses include industrial automation, communications equipment, embedded control, test and measurement, signal processing, and compact network interfaces. The combination of programmable logic, block RAM, and 186 I/O permits designers to consolidate parallel control, data buffering, and protocol handling in one device. A complete design still requires suitable clocking, configuration storage, decoupling, and board-level signal-integrity implementation. When planning a board, verify every BGA-256 land pattern against the AMD Spartan-6 package pinout files and the selected device’s official package drawing. The -3 speed grade and commercial C suffix must also be treated as part of the exact ordering code rather than assumed interchangeable with other Spartan-6 grades or temperature options. This page consolidates the verified distributor specifications, 256-LBGA sourcing information, same-family replacement candidates, pricing evidence, and practical FPGA design considerations into one engineering-focused reference. It distinguishes directly documented facts from package details or operating parameters that still require confirmation from the complete AMD device documentation.
XC6SLX16-3FT256I - Spartan-6 LX FPGA, 14579 Cells, 186 I/O | AMD
The AMD/Xilinx XC6SLX16-3FT256I is a Spartan-6 LX field programmable gate array (FPGA) delivering 14,579 logic cells, 1,139 configurable logic blocks (CLBs) and 186 user I/O, with a maximum internal clock frequency of 667 MHz on a 1.2 V core supply, packaged in a 256-ball FTBGA (FT256) surface-mount package measuring 17 x 17 mm with 1.0 mm ball pitch. An FPGA is a reconfigurable digital integrated circuit whose logic, memory and I/O are defined by a bitstream loaded at power-up. A logic cell contains a lookup table plus flip-flops and routing resources, and thousands of such cells are interconnected by a programmable switch matrix. The Spartan-6 LX family is the logic-optimized member of the Spartan-6 series: it targets designs dominated by wide datapaths, control logic, protocol bridges and video/interface consolidation rather than maximum DSP density. In the device hierarchy, this part sits as a programmable logic device within the FPGA & CPLD family of integrated circuits. Key characteristics of the XC6SLX16-3FT256I include the -3 speed grade, which is the highest-performance Spartan-6 LX grade available, and a 45 nm CMOS process node that keeps both static power and dynamic power manageable in cost-sensitive embedded systems. The device provides 186 user I/O in a compact 256-ball grid, which is a high I/O-to-logic ratio for a device of this size. Temperature handling is specified as 0 C to +85 C (32 F to 185 F) with industrial-grade parts marking, and the FT256 package is offered in a lead-free configuration. Technically, the device combines LUT-based six-input logic architecture with dedicated block RAM for data buffering and DSP-oriented arithmetic, plus SelectIO resources that support high-speed memory interfaces and common I/O standards through selectable I/O drivers. Because the device is a -3 grade part, timing closure is the easiest of the Spartan-6 LX options, giving the highest achievable system clock and the greatest margin on demanding multi-clock domains. Configuration is handled through the standard Xilinx JTAG and configuration interface scheme, supporting both persistent and reconfiguration-oriented design flows. Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and fieldbus bridging, video and image datapath consolidation, USB and multi-protocol interface hubs, motor and motion control sequencers, and compact embedded control platforms for aerospace, telecommunications and consumer networking equipment. When designing with this device, plan the power budget and thermal design around the 1.2 V core supply and the I/O supply rails, and confirm the pinout against the AMD Spartan-6 package pinout files for the FT256 package before layout. Because the FT256 package is a dense 1.0 mm-pitch BGA, a fine-pitch assembly and adequate solder mask and paste control are required to avoid bridging defects. This page consolidates distributor pricing, verified drop-in replacement options, and packaging and thermal design notes for the XC6SLX16-3FT256I that are not consolidated in any single manufacturer document, so engineers can evaluate the device and its alternates before committing a PCB layout.
XC6SLX16-3FTG256C - Spartan-6 LX FPGA, 14k LCs, 256-FTBGA | AMD
The AMD (formerly Xilinx) XC6SLX16-3FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) providing 14,579 logic cells, 186 maximum user I/Os, and 256 Kbits of distributed RAM in a 256-ball fine-pitch thin-ball grid array (FTBGA-256, 17 x 17 mm, 1.0 mm pitch). It uses 45 nm CMOS process technology and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital circuits using configurable logic blocks (CLBs), programmable I/Os, on-chip memory, and dedicated hard IP such as transceivers, DSP slices, and clock management tiles. FPGAs are part of the programmable logic hierarchy alongside CPLDs and sit between discrete logic and ASICs in system design trade-offs. The XC6SLX16-3FTG256C features 1139 CLBs, 32 DSP48A1 slices, two clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and SelectIO high-performance I/O supporting LVDS, LVCMOS, LVTTL, SSTL, and HSTL standards across 8 I/O banks. The -3 speed grade targets high-performance designs with up to 667 MHz internal clocking. Typical applications include industrial motor control, video processing pipelines, automotive driver assistance, low-cost wireline aggregation, and embedded control systems. Its small 17 x 17 mm BGA footprint suits cost-sensitive high-volume designs. Design tips: pay careful attention to the banked I/O supply pins (VCCO), keep the auxiliary supply VCCAUX at 2.5 V to 3.3 V, and use the -C commercial temperature grade (0 C to +85 C) only inside chassis environments. This page aggregates DigiKey/Mouser distributor pricing, same-footprint alternatives in the Spartan-6 family, and 45 nm power-rail guidance not found in the manufacturer datasheet.
XC6SLX16-3FTG256I - Spartan-6 LX FPGA, 14K Logic Cells, 256-FTBGA | AMD Xilinx
The AMD Xilinx XC6SLX16-3FTG256I is a Spartan-6 LX field-programmable gate array (FPGA) integrating 14,579 logic cells (1,139 Configurable Logic Blocks), 589,824 bits of block RAM, and 186 user I/O into a 256-ball fine-pitch thin-ball grid array (FTBGA, 17 x 17 mm, 1.0 mm pitch) package, qualified to the industrial temperature range (-40C to +100C). It belongs to the -3 speed grade, the highest performance tier within the Spartan-6 LX family, and is fabricated on a 45 nm CMOS process that lowers static power relative to earlier 65 nm Spartan generations while preserving the 667 MHz internal operation supported by the silicon. A field-programmable gate array (FPGA) is a semiconductor device built from an array of programmable logic blocks, programmable interconnect, programmable I/O cells, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. Within the broader taxonomy it sits alongside CPLDs, gate arrays, and ASICs as a re-programmable digital logic device; FPGAs differ from CPLDs mainly in density and architectural granularity, and differ from ASICs by being configurable post-fabrication. The Spartan-6 LX family is positioned by AMD Xilinx as the cost-optimized, low-power member of the Spartan-6 generation, ideal for bridging, display, and motor-control in ASICs and ASSPs. Key features include integrated block RAM up to 589,824 bits, dual 10/100/1000 Mbps Ethernet MAC hardening options, a low-power 45 nm process with 1.2 V core voltage, integrated PCI Express endpoint block in LXT variants, and a programmable I/O voltage range that supports common single-ended and differential standards. The CLB array contains 1,139 logic cells arranged to deliver balanced logic, memory, and DSP resources, and the package's fine-pitch BGA delivers compact board area while keeping signal integrity manageable for the supported I/O rates. Spartan-6 LX uses the proven 45 nm CMOS process and the 6th-generation Xilinx FPGA architecture, bringing logic, block RAM, DSP48A1 slices, and clock management tiles (CMT) into a low-cost fabric. Memory controllers (hard MCBs) support DDR, DDR2, DDR3, and LPDDR external memory interfaces up to 800 Mb/s data rates, and the integrated GTP serial transceivers in LXT parts deliver multi-gigabit connectivity for cost-sensitive serial links. Typical applications for the XC6SLX16-3FTG256I include industrial motor-control and PLC backplanes, low-cost video bridging and consumer display controllers, automotive infotainment and telematics subsystems, machine-vision front ends, and PCIe endpoint cards in cost-sensitive computing. The wide industrial temperature range and high I/O count make it a frequent building block in factory automation and embedded vision designs. When designing with this FPGA, ensure that the I/O bank voltages reference the classfree reference design, ensure that the configuration memory (typically a SPI or BPI flash) is sized for the bitstream, and ensure that the FPGA's power-on sequencing and decoupling network match the Spartan-6 power distribution guidance in UG393 to ensure reliable industrial-temperature operation. Designers should also budget for ISE Design Suite or Vivado (legacy) toolchain support and the appropriate license. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers an at-a-glance view of where the XC6SLX16-3FTG256I fits in the Spartan-6 LX family and what alternatives exist for sourcing continuity.
XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD
The AMD XC6SLX25-2FG484C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 266 I/O, a 500 MHz internal frequency, and a 484-ball FBGA package. Built on 45 nm CMOS technology and operating from a 1.2 V core supply, it combines programmable logic, 266 user I/O, and embedded block RAM in a single device. The -2 speed grade supports designs requiring predictable general-purpose FPGA performance, while the commercial temperature option covers 0°C to 85°C. A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnects, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where it sits above fixed-function logic devices and provides parallel hardware implementation for control, signal processing, communications, and interface functions. Its value comes from combining substantial configurable logic density with reusable intellectual property cores, allowing one package to replace multiple conventional logic components. The Spartan-6 LX family provides 24,051 logic cells for this device, 266 I/O, and 45 nm CMOS fabrication. The -2 designation identifies its performance grade, while the 484-ball package supports dense board routing through an array of solder-ball connections. The device is identified as lead-free and RoHS compliant in the supplied component data. These characteristics make it relevant to industrial control, communications, instrumentation, embedded signal processing, and general-purpose prototyping systems. At the architecture level, the Spartan-6 LX FPGA combines configurable logic blocks with dedicated block RAM and programmable I/O resources. This mixed architecture allows parallel datapaths and state machines to be implemented without relying on a processor for every control function. The supplied data identifies a 500 MHz internal frequency, while actual interface and system timing remain dependent on the selected I/O standards, clocking implementation, board-level routing, external memory interface, and the selected design tools. Typical uses include industrial automation controllers, serial and parallel protocol bridges, data-acquisition front ends, communications equipment, and embedded DSP functions. Its 266 I/O count is particularly useful when a design must connect multiple buses, capture parallel sensor data, or bridge legacy peripheral logic to a modern system. The 484-ball FBGA also reduces board area compared with a large leaded package, but it demands careful escape routing and assembly control. A primary design consideration is package and PCB complexity. Unlike a fine-pitch QFP, the 484-ball FBGA is not visually inspectable after assembly and requires appropriate land patterns, via-in-pad or escape-routing rules, X-ray inspection capability, and controlled solder-assembly profiles. Designers should also confirm power sequencing, decoupling, clock integrity, and I/O voltage compatibility against the complete AMD device documentation before layout release. This page consolidates the verified device identity, package information, commercial listing, and cross-reference findings into an engineering-focused product record. It also distinguishes true package-compatible Spartan-6 options from unrelated FPGA families, helping procurement and hardware teams assess interchangeability without assuming that equivalent logic density guarantees interchangeable pinout, timing, or qualification.
XC6SLX25-2FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
AMD/Xilinx XC6SLX25-2FG484I is a Spartan-6 LX FPGA with 24,051 logic cells, 266 I/O, 45 nm CMOS technology, 1.2 V operation, and a 484-pin FBGA package. The -2 speed grade is designed for industrial-temperature operation from 0 C to 85 C, as identified in the verified component listings. The device combines programmable logic, block RAM, DSP resources, and programmable I/O in a single FPGA package, making it suitable for embedded control, communications, industrial automation, signal processing, and general-purpose digital design. Its 484-ball package provides a high-density interconnect arrangement for designs requiring numerous external interfaces. The Spartan-6 LX FPGA family is a programmable-logic device family within the broader FPGA and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic behavior, interfaces, and signal processing to be configured after manufacture. This flexibility supports design revisions, shorter product-development cycles, and consolidation of multiple control functions into one programmable device when appropriate system partitioning and validation are performed. Key verified characteristics include 24,051 logic cells, 266 I/O, 1.2 V operation, 45 nm CMOS construction, and a 484-pin FBGA package. The -2 speed grade provides a defined performance class within the Spartan-6 LX family. The I/O count makes the device suitable for systems requiring parallel buses, multiple control signals, external memory interfaces, converters, and communication transceivers. Because the package is ball-grid and densely routed, PCB layout requires careful ball assignment, power planning, decoupling, and signal-integrity review. Typical uses include industrial PLC and automation controllers, embedded instrumentation, communications equipment, video and image-processing front ends, and low-power control subsystems. The FPGA can implement parallel algorithms, state machines, protocol bridges, and control logic in parallel, reducing reliance on multiple discrete controllers. Its programming flexibility also allows firmware-like field updates when the surrounding flash and configuration architecture are included. Design considerations center on thermal performance, decoupling, configuration, and high-speed board layout. The 1.2 V core and dense 484-ball package require multiple supply rails and careful placement of bypass capacitors. Designers should use the AMD Spartan-6 package pinout and device documentation for exact ball assignments, power sequencing, configuration pins, and I/O standards before layout release. This page combines verified distributor and manufacturer-source information with package, purchasing, and engineering guidance designed to make the XC6SLX25-2FG484I selection process faster.
XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD
The AMD XC6SLX25-2FGG484I is a Field Programmable Gate Array (FPGA) from the Spartan-6 LX family, built on a mature 45 nm low-power copper process technology. It delivers 24,051 logic cells, 958,464 bits of block RAM, and 266 user I/O pins in a 484-ball FBGA package (23x23 mm, 1 mm pitch). The device operates at a core voltage of 1.2V and supports internal clock frequencies up to 500 MHz, with a -2 speed grade providing a balanced performance-power trade-off. An FPGA is an integrated circuit that can be programmed after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and general-purpose processors in the semiconductor hierarchy. They offer reconfigurability, parallel processing, and low non-recurring engineering costs, making them ideal for prototyping, low-to-mid volume production, and applications requiring hardware flexibility. Key features of the XC6SLX25-2FGG484I include 24,051 logic cells, 52 DSP48A1 slices, 958,464 bits of block RAM, and support for multiple I/O standards including LVCMOS, LVDS, and SSTL. The device also features integrated memory controllers, clock management tiles (CMT) with PLL and DCM, and support for PCI Express (in LXT variants). The -2 speed grade offers a balance between performance and power consumption, with a maximum internal frequency of 500 MHz. The Spartan-6 family is designed for high-volume, cost-sensitive applications, offering half the power consumption of previous Spartan families. The 45 nm process technology enables high logic density and low static power. The device includes advanced power management features such as suspend mode and partial reconfiguration support, allowing dynamic power optimization in battery-powered systems. Typical applications include industrial automation, automotive infotainment, medical imaging, communications infrastructure, and video processing. The 484-ball FBGA package provides ample I/O for interfacing with external memory, ADCs, DACs, and high-speed serial transceivers (in LXT variants). The industrial temperature grade (-40°C to +100°C) makes it suitable for harsh environments. When designing with this FPGA, ensure proper decoupling of the 1.2V core supply and 2.5V/3.3V auxiliary supplies. Use the configuration pins (MODE, DONE, PROG_B) for reliable device programming. The device supports multiple configuration modes including Master SPI, Slave SelectMAP, and JTAG, providing flexibility in system design.
XC6SLX25-2FT256I - Spartan-6 LX FPGA, 24K Logic Cells | AMD
The AMD (formerly Xilinx) XC6SLX25-2FT256I is a Spartan-6 LX Field-Programmable Gate Array (FPGA) integrating 24,051 logic cells, 1,879 Configurable Logic Blocks (CLBs), and 958 Kbits of block RAM in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA-256) package. It is built on a 45 nm CMOS process, supports up to 186 user I/O, and runs at internal frequencies up to 500 MHz in this -2 (standard performance) and -I (industrial temperature, -40C to +100C) grade. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock-management tiles (CMTs). FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class parallelism and data-path throughput while remaining fully re-programmable in the field. The Spartan-6 LX family is positioned at the low-cost, low-power end of the AMD/Xilinx FPGA portfolio and is widely used in bridging, motor control, video processing, and industrial automation. Key features of the XC6SLX25-2FT256I include 24,051 logic cells, 1,879 CLBs, 4,824 Kbits of distributed RAM, 38 DSP48A1 slices running up to 390 MHz, 2 CMTs for PLL-based clock management, and a 32-bit MultiBoot configuration controller. Industrial temperature grade -I supports -40C to +100C operation. The FT256 package provides 186 user I/O across 256 balls with 1.0 mm pitch and 17 x 17 mm body. The -2 speed grade offers the standard balance of performance and power consumption for cost-sensitive embedded designs. The architecture pairs 6-input Look-Up Tables (LUT6) with dual flip-flops per slice, enabling efficient state-machine and pipelined datapath implementations. The Memory Controller Block (MCB) supports DDR, DDR2, DDR3, and LPDDR external memories at up to 800 Mb/s, while the SelectIO technology supports voltages from 1.2 V to 3.3 V on the same bank. Typical applications include industrial control and bridging, automotive infotainment head units, motor and servo drive feedback, low-cost video processing, custom glue logic replacement, and consumer electronics requiring low-power parallel DSP. The wide temperature grade also makes it suitable for factory automation and outdoor display systems. When designing with this part, note that Spartan-6 FPGAs require a separate configuration memory or JTAG programming interface; the device does not boot from internal flash. Plan the bank I/O voltage ahead of placement to avoid level-shifter overhead. This page consolidates distributor pricing for the AMD XC6SLX25-2FT256I, drop-in FT256 Spartan-6 variants, and practical design notes that go beyond the manufacturer datasheet summary.
XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
Advanced Micro Devices, Inc. XC6SLX25-3FG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 24,051 configurable logic cells, a 1.2 V core supply, and a 500 MHz internal frequency in a 15 x 15 mm lead-free CSBGA package. The -3 speed grade is identified as the highest-performance Spartan-6 LX grade in the supplied technical documentation. A field-programmable gate array, or FPGA, is a programmable logic device that combines configurable logic, programmable I/O, and dedicated processing resources on one semiconductor die. FPGAs occupy the programmable-logic hierarchy between fixed-function logic ICs and higher-end adaptive computing devices. They allow hardware functions to be revised through configuration bitstreams rather than redesigning a custom ASIC, reducing prototype cycles and supporting field upgrades. The XC6SLX25-3FG484C provides 24,051 logic cells and 1,879 configurable logic blocks, according to the indexed Spartan-6 comparison data. Its 500 MHz internal-frequency listing makes it suitable for parallel logic, state-machine, control, interface, and signal-processing designs that require deterministic hardware operation. The 484-BBGA package also exposes substantially more connection options than a small quad-flat package. The device combines configurable logic with DSP48 processing resources and dedicated block RAM for filtering, transforms, communications encoding, and other data-intensive functions. Its 45 nm CMOS implementation and 1.2 V core voltage place it in the Spartan-6 generation designed to balance programmable logic capacity, I/O connectivity, power efficiency, and cost for cost-sensitive, high-volume equipment. Typical uses include industrial automation and control, video-processing pipelines, communications infrastructure, instrumentation, embedded systems, and interface consolidation. The 24,051-cell Spartan-6 LX device is particularly appropriate when parallel datapath logic, moderate DSP requirements, and extensive package I/O are needed without moving immediately to a larger FPGA or developing a custom ASIC. Design planning must account for the BGA escape routing, decoupling, clock integrity, configuration memory, and thermal performance of a 484-ball package. Although the indexed operating-temperature range is 0 to 85 °C, thermal design should be evaluated for the actual board, enclosure, airflow, and activity level rather than relying only on the commercial temperature designation. This product record combines verified distributor availability, exact package and device identifiers, Spartan-6 family specifications, drop-in same-package comparisons, and procurement-oriented guidance. It distinguishes confirmed data from unavailable numeric pricing, pin-by-pin mapping, and detailed power characteristics so engineers can make sourcing and design decisions without relying on inferred values.
XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
AMD/Xilinx XC6SLX25-3FG484I is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 266 I/O, and 500 MHz internal frequency, supplied in a 484-BBGA package. The -3 speed grade represents the highest-performance Spartan-6 LX grade identified in the verified product data. Its 45 nm CMOS construction and 484-ball surface-mount package support compact industrial, communications, control, and embedded-processing systems where programmable logic is required. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and peripheral functions are configured after manufacture. The FPGA hierarchy extends from configurable logic blocks and programmable interconnect to FPGA, programmable logic device, and digital semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA allows interface changes, parallel processing, and hardware customization to be implemented in a single device while retaining the flexibility of field updates. The XC6SLX25-3FG484I combines 24,051 logic cells with 266 available I/O in a 484-BBGA package. The verified data identifies a 500 MHz internal frequency, a -3 speed designation, and operation from 0°C to 85°C. Its 484-ball format supports substantially denser board routing than a low-pin-count FPGA package, while the 15 mm by 15 mm body and 0.80 mm ball pitch provide a practical high-density footprint for multilayer PCB layouts. The Spartan-6 LX architecture is positioned between fixed logic and higher-end programmable SoC devices. Its logic resources can implement parallel data acquisition, protocol conversion, control state machines, and interface bridging, while its I/O count allows multiple external buses and high-speed links to converge on one package. The -3 grade favors designs in which timing performance is more important than the lower power or lower cost associated with slower speed grades. Typical uses include industrial automation, embedded control, communications equipment, test and measurement systems, signal processing, and generic embedded processing. The 266 I/O are useful when a design must connect external memories, transceivers, converters, and control peripherals. The 500 MHz internal frequency also provides a meaningful clocking target for pipelined logic, provided that board-level timing closure is completed with the selected toolchain and design constraints. Engineers should treat the 484-BBGA as a demanding fine-pitch package. PCB design must provide adequate escape routing, power and ground planes, via access, and thermal spreading. The verified sources expose a pinout-file resource, but the complete 484-ball pin map and exact power requirements were not included in the supplied data; those details must therefore be confirmed against the manufacturer package files and datasheet before release. This product record combines verified distributor availability information, exact device identity, package characteristics, and practical design considerations with same-family replacement guidance. It distinguishes confirmed facts from unresolved parameters and avoids presenting an unverifiable pinout, price schedule, or cross-vendor equivalence as established data.
XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD
The AMD XC6SLX25-3FGG484I is a member of the Spartan-6 LX family of Field Programmable Gate Arrays (FPGAs), fabricated using a 45nm CMOS process technology. It features 24,051 logic cells, 1,879 configurable logic blocks (CLBs), and 958,464 total RAM bits, providing a balanced mix of logic density and memory resources for a wide range of digital designs. The device is offered in a 484-ball FBGA package (23x23 mm) with 266 user I/O pins, supporting diverse interface standards and flexible I/O configurations. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors in terms of flexibility and performance. The Spartan-6 series is optimized for low power and cost-sensitive applications, making it a popular choice for industrial, automotive, and telecommunications systems. Key features of the XC6SLX25-3FGG484I include a speed grade of -3, which is the highest performance grade available for Spartan-6 LX devices, enabling faster clock frequencies and improved timing margins. The device operates from a 1.2V core supply (1.14V to 1.26V range) and supports multiple I/O standards, including LVCMOS, LVDS, and HSTL. It also includes dedicated DSP48A1 slices and block RAM for efficient implementation of arithmetic and memory-intensive functions. From a technical perspective, the Spartan-6 architecture incorporates a 6-input look-up table (LUT) fabric, advanced clock management tiles (CMTs) with PLLs and DCMs, and high-speed serial transceivers (in LXT variants). The -3 speed grade provides a maximum internal frequency of 500 MHz, as noted in the datasheet, enabling high-throughput designs. The device is RoHS compliant and lead-free, meeting modern environmental standards. Typical applications for the XC6SLX25-3FGG484I include industrial automation, telecommunications infrastructure, automotive electronics, and video/image processing. Its combination of logic density, I/O count, and low power consumption makes it suitable for bridging, protocol conversion, and real-time control tasks. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout to ensure signal integrity at high speeds. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and proper sequencing during power-up. Refer to the Spartan-6 FPGA datasheet and PCB design guidelines for detailed recommendations.
XC6SLX25-3FT256C - 24,051-Cell Spartan-6 LX FPGA | AMD
The Xilinx XC6SLX25-3FT256C is a Spartan-6 LX field-programmable gate array with 24,051 logic elements, 186 I/O, a 1.2 V core supply, and a 256-pin FTBGA package. Built with 45 nm CMOS technology, this FPGA combines 3,758 adaptive logic modules, 1,879 configurable logic blocks, and 936 kbit of embedded memory in a compact 17 x 17 mm package. The -3 designation identifies the device performance grade, while the 256 suffix identifies the 256-ball package configuration. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The Spartan-6 LX FPGA family belongs to the broader FPGA hierarchy, which sits between fixed-function logic ICs and programmable ASICs. It combines hardware parallelism, field-updatable configuration, and deterministic control capabilities for systems requiring custom logic, interface adaptation, or signal processing. The verified device data identifies 3,758 adaptive logic modules, 1,879 configurable logic blocks, 936 kbit of embedded memory, and 186 I/O. Its 45 nm CMOS implementation operates from a 1.2 V core, making it appropriate for compact embedded systems where power, board area, and computational throughput must be balanced. The Spartan-6 architecture also supports programmable logic blocks, block RAM, digital signal processing resources, and dedicated input/output functions, although individual resource counts beyond those published here require confirmation in the manufacturer documentation. The XC6SLX25 device is positioned between smaller Spartan-6 LX members and larger LX fabrics. Compared with the XC6SLX9, it provides substantially more configurable logic and embedded memory, making it suitable for multi-channel control, protocol bridging, and parallel data processing. The verified XC6SLX25 comparison data also lists a 667 MHz performance figure, but the exact relationship between that figure and the -3 speed suffix should be confirmed against the applicable AMD/Xilinx device documentation for the intended design. Typical uses include industrial automation, communications equipment, embedded control, video and image processing, sensor acquisition, and compact embedded platforms. The 186 I/O provide substantial board-level connectivity, while the 936 kbit of embedded memory can support buffering, packet handling, and control functions without relying entirely on external memory. These resources make the device useful for designs combining a processor or microcontroller with dedicated high-speed or parallel logic. Designers should use the official Spartan-6 package pinout and power-guidance documents rather than inferring BGA connectivity from a generic package drawing. PCB layout must provide the specified core and I/O supplies, decoupling, clocking, configuration storage, and exposed-pad thermal treatment. Because the supplied data does not contain the complete 256-ball pinout or recommended operating ranges, those details remain data-needed rather than being inferred. This product page consolidates the verified 24,051-cell, 1.2 V, 45 nm, 256-pin device attributes, current distributor pricing, same-family drop-in candidates, and practical replacement guidance. It provides engineering context that is not available from a distributor inventory listing alone, while clearly separating verified facts from documentation that still requires confirmation.
XC6SLX25-3FT256I - 24,051-Cell Spartan-6 LX FPGA | AMD
AMD XC6SLX25-3FT256I is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 1,879 configurable logic blocks, 186 I/O, and a maximum internal frequency of 500 MHz, housed in a 256-ball lead-free LBGA package measuring 17 x 17 mm. It uses 45 nm CMOS technology and operates from a 1.2 V core supply. The -3 speed grade is identified as the highest-performance Spartan-6 LX grade, while the industrial suffix identifies the specified operating-temperature version. A field-programmable gate array is a programmable logic device that converts a digital design into an interconnected array of configurable logic blocks and programmable I/O. In the product hierarchy, an FPGA is a programmable logic semiconductor, a broader category than a fixed-function application-specific integrated circuit. The Spartan-6 LX family balances programmable logic capacity, embedded memory, connectivity, and cost for embedded, industrial, communications, and signal-processing systems. Key features include 24,051 logic cells organized into 1,879 CLBs, 3,758 adaptive logic modules, and 936 kbit of embedded memory according to the comparison data retrieved for this family. The device provides 186 user I/O and uses a 256-ball lead-free package. Its 500 MHz internal-frequency listing, -3 performance grade, 45 nm CMOS construction, and 1.2 V core supply make it suitable for designs requiring substantial parallel processing without moving to a larger FPGA family. The LX device architecture combines programmable logic, block RAM, digital signal processing resources, general-purpose I/O, clock management, and dedicated configuration capabilities. These resources allow designers to implement parallel datapaths, control logic, protocol interfaces, and data acquisition functions in one device. The 24,051-cell capacity also permits more substantial consolidation than small CPLDs, while the 256-ball package provides a defined route for dense, board-level integration. Typical applications include industrial automation, embedded control, communications infrastructure, instrumentation, data acquisition, and digital signal processing. The target part is particularly relevant when a design must combine moderate-to-high logic density with a 256-ball Spartan-6 LX footprint and the -3 speed grade. Designers should also verify power, configuration, memory interface, and pin constraints against their complete system requirements. A critical design step is to match the exact device variant, package drawing, exposed-pad treatment, and PCB land pattern before production. Configuration storage, clocking, decoupling, signal integrity, and thermal performance must be reviewed against AMD's Spartan-6 documentation. Do not infer full pin compatibility from a shared ball count alone. This page consolidates verified distributor specifications, exact package information, source links, and drop-in alternatives with engineering-oriented selection guidance. It also distinguishes documented facts from parameters that require confirmation, providing a more practical basis for procurement and hardware planning than a distributor listing alone.
XC6SLX25-N3CSG324C - Spartan-6 FPGA, 24051 Cells | AMD
The AMD XC6SLX25-N3CSG324C is a member of the Spartan-6 LX family of Field Programmable Gate Arrays (FPGAs), designed for high-volume, cost-sensitive applications that require leading system integration capabilities. This device features 24,051 logic cells, 226 user I/O pins, and 958,464 total RAM bits, all housed in a 324-ball CSBGA (Chip-Scale Ball Grid Array) package. Operating from a 1.2V core supply, the XC6SLX25-N3CSG324C is fabricated using a 45nm process technology, balancing performance with power efficiency. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be programmed after manufacturing to implement any digital logic function. FPGAs consist of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing designers to create custom hardware without the cost and lead time of ASIC development. The Spartan-6 family sits within the broader FPGA hierarchy, positioned as a cost-optimized line below the higher-performance Virtex and Kintex families, making it ideal for applications where price and power are critical. Key features of the XC6SLX25-N3CSG324C include 1,879 CLBs, 38 DSP48A1 slices for digital signal processing, and support for a wide range of I/O standards through SelectIO technology. The device also includes enhanced mixed-mode clock management (MMCM) blocks for precise clock generation, and supports configuration via JTAG, SPI, and BPI interfaces. With a junction temperature range of 0°C to 85°C, this commercial-grade FPGA is suitable for typical industrial and consumer environments. The Spartan-6 architecture incorporates advanced power management modes, including suspend and hibernate states, to reduce static power consumption. The 45nm process technology enables high logic density while maintaining low dynamic power, making the XC6SLX25-N3CSG324C an energy-efficient choice for battery-powered or thermally constrained designs. Additionally, the device supports AES bitstream encryption and Device DNA protection for enhanced IP security. Typical applications for the XC6SLX25-N3CSG324C include motor control, industrial networking, video processing, and software-defined radio. Its 226 I/O pins and 324-ball package provide ample connectivity for interfacing with sensors, ADCs, DACs, and communication transceivers. The FPGA's reconfigurability allows for rapid prototyping and field updates, reducing time-to-market. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout to ensure signal integrity at high I/O speeds. The device requires a 1.2V core supply and 2.5V/3.3V auxiliary supplies, with proper sequencing as specified in the datasheet. Thermal management is also important, as the CSBGA package has a thermal resistance that must be considered for high-utilization designs.
XC6SLX4-2CPG196C - 3,840-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX4-2CPG196C is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 106 I/O, 196 CSBGA balls, and 45 nm CMOS technology in a 1.2 V device. It is packaged as a 196-TFBGA/CSBGA and is identified by the -2 speed grade and C commercial temperature designation. The device also provides 221,184 registers and 216 Kb block RAM according to the verified product search data. A field-programmable gate array, or FPGA, is a programmable digital semiconductor in which logic, memory, and I/O behavior are configured through a bitstream after manufacture. The Spartan-6 LX FPGA family is intended for compact embedded systems requiring deterministic parallel logic, programmable I/O, and moderate on-chip memory. The XC6SLX4-2CPG196C therefore sits between fixed-function logic and higher-capacity programmable-logic devices. The verified data identifies the part as a Spartan-6 LX FPGA with 106 I/O, 3,840 logic cells, 196-CSBGA packaging, 1.2 V operation, and 45 nm CMOS technology. The device also includes 8 DSP slices and up to 3.2 Gbps transceiver performance in the supplied comparison source. These characteristics make it suitable for embedded control, industrial automation, communications, instrumentation, and compact signal-processing designs. The -2 suffix is a speed-grade designation, while the C suffix identifies the commercial temperature option according to the part naming convention reflected in the search results. The 196-CSBGA package provides a high ball count for dense I/O and power distribution, but it requires careful PCB layout, via-in-pad or escape routing strategies, and thermal planning. Configuration, programming, and tool support must be checked against the selected system design before releasing a production layout. For new designs, engineers should verify the complete pinout, supported I/O standards, configuration requirements, and power-supply sequencing in the manufacturer datasheet. The BGA package makes fanout and assembly inspection more demanding than a leaded package, so PCB fabrication and assembly capability should be confirmed early. This page consolidates verified distributor results, a real part price observation, package information, and design-oriented selection guidance. It does not infer missing electrical limits, timing values, lifecycle guarantees, or compliance claims that were not present in the supplied data.
XC6SLX4-2CSG225C - 3840-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX4-2CSG225C is a Spartan-6 LX field-programmable gate array with 3840 logic cells, 132 I/O, a 45 nm CMOS process, and a 225-CSBGA package. It targets cost-sensitive, high-volume embedded systems that need programmable logic, parallel interfaces, control functions, and modest signal-processing capability. The part is identified as a 225-LFBGA/CSPBGA package in distributor listings, while the exact CSG225 package terminology should be confirmed against the AMD package documentation. What is an FPGA? An FPGA is a programmable semiconductor whose configurable logic blocks, programmable I/O, memory resources, and dedicated hardware can be tailored after manufacture. An FPGA sits above fixed-function digital ICs in the design hierarchy: instead of requiring a new mask for every logic change, engineers can implement control, interface, timing, and signal-processing functions in one reconfigurable device. The Spartan-6 LX family is positioned for high-volume applications where system integration and cost matter more than the very highest device density. The XC6SLX4-2CSG225C is reported with 132 I/O and 3840 logic cells. Its 45 nm CMOS implementation is relevant to power, switching activity, and tool-supported timing closure. The 225-CSBGA package provides a high pin-count surface-mount option for designs requiring substantial external connectivity. Detailed block counts, memory quantities, I/O standards, voltage limits, temperature grades, and timing constraints are not fully present in the supplied search snippets and must be obtained from the AMD Spartan-6 documentation before release. Typical uses include industrial automation, programmable control, communications equipment, instrumentation, and embedded signal-processing systems. In these applications, the FPGA can implement protocol interfaces, state machines, sampling pipelines, timing controllers, or parallel-to-serial conversion. The design still requires correct bank voltage planning, I/O-standard assignment, clocking, decoupling, programming, and thermal assessment. A pin-compatible replacement cannot be assumed merely because another FPGA has similar resource counts; package ballout, voltage standards, configuration memory, clock resources, and timing margins must all match. This page is limited to values explicitly supported by the supplied verified web data. It distinguishes documented facts from missing design data rather than estimating FPGA specifications, pricing, pin assignments, or electrical limits. Check the current AMD product documentation and authorized distribution records before committing a new PCB or production release.
XC6SLX4-2CSG225I - 3840-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX4-2CSG225I is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 132 I/O, a maximum stated frequency of 375 MHz, and a 225-CSBGA package. It is manufactured on 45 nm CMOS technology and supports a stated 1.14 V to 1.26 V operating range. The -2 designation identifies the device speed grade, while the I suffix denotes the industrial temperature option. What is an FPGA? A field-programmable gate array is a programmable semiconductor containing configurable logic, memory, and I/O resources. An FPGA replaces application-specific digital logic with a flexible hardware implementation that can be loaded, verified, and revised. The Spartan-6 LX family is positioned for cost-sensitive embedded, industrial, communications, and bridging applications where deterministic parallel logic is useful. Key features of the XC6SLX4 include 3,840 logic cells and 132 I/O. The verified product information also identifies DCM and PLL resources and a 375 MHz frequency value. The 225-CSBGA package supports compact system integration, while the industrial-temperature marking makes the device relevant to equipment expected to operate beyond commercial-temperature conditions. The device is built on 45 nm CMOS technology and belongs to the Spartan-6 FPGA family. Its architecture combines programmable logic with dedicated FPGA resources, allowing designers to implement control logic, interfaces, data processing, and signal conditioning in one device. The -2 speed grade and stated 375 MHz figure should be evaluated against the actual timing constraints of the selected design. Typical applications include industrial automation, automotive infotainment, consumer equipment, embedded control, communications bridging, interface conversion, and general-purpose digital signal processing. The Spartan-6 LX positioning supports low-cost, high-volume systems that benefit from hardware programmability and parallel processing. A key design consideration is package-level planning. Before assigning pins, engineers should use the AMD Spartan-6 package device pinout files and verify power, ground, configuration, clock, and I/O constraints for the CSG225 package. Bitstream compatibility, device identification, memory initialization, and temperature grade must also be confirmed before a replacement is approved.
XC6SLX4-2TQG144C - Spartan-6 LX FPGA 4K Logic Cells | AMD Xilinx
The AMD Xilinx XC6SLX4-2TQG144C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) offering 3,840 logic cells, 4,860 Kbits of block RAM, and 102 user I/Os in a 144-pin LQFP (TQG144) package. The -2 speed grade targets commercial temperature operation (0 °C to +85 °C), and the 'C' suffix indicates the commercial temperature tier suitable for most industrial and consumer environments. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks such as Block RAM, DSP slices, and clock management tiles. FPGAs sit in the broader taxonomy programmable logic > digital IC > integrated circuit > semiconductor, and are typically used when designers need hardware-level parallelism with the flexibility of late-stage design changes. Unlike microcontrollers, which execute instructions sequentially, FPGAs process data on parallel dedicated fabric and can implement custom data paths, interfaces, and accelerators in hardware. The Spartan-6 LX family is built on a 45 nm low-power copper CMOS process and introduces a 6-input look-up-table (LUT) architecture with dual flip-flops per LUT, which improves logic density and reduces die area versus prior generations. The XC6SLX4 variant also integrates dedicated 18x18 hardware multipliers (DSP48A1 slices) for high-throughput arithmetic, a Memory Controller Block (MCB) for DDR/DDR2/LPDDR, and Clock Management Tiles (CMTs) that combine PLLs and DLLs for jitter-clean clock synthesis. Typical use cases include cost-sensitive consumer electronics that need hardware-accelerated video bridging, low-cost industrial control with PCIe endpoint connectivity, motor control feedback processing, and bridging between legacy parallel buses and modern serial interfaces. Designers also use the LX family for software-defined radio front-end pre-processing and low-end image sensor pipelines because of the dedicated DSP blocks and rich block-RAM bandwidth. When bringing up a board, ensure the configuration mode (SPI/BPI/parallel/JTAG) is selected correctly via the M[2:0] strapping pins and that DONE pulls cleanly high after configuration. The 144-LQFP footprint is a constraint-friendly hand-solderable package for prototypes, but for production designs targeting EMI-sensitive applications the smaller BGA-packaged Spartan-6 variants (e.g. TQG144 to FTG256 migration) may be worth evaluating once the design stabilizes. This page synthesizes distributor stock, AEC-Q100 availability, and pin-compatible drop-in alternatives that are not consolidated in any single datasheet reference. Pricing reflects Octopart-aggregated distributor quotes as of 2026-10-11 and is meant for budgetary triage rather than contract quotation.
XC6SLX4-2TQG144I - 3840-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX4-2TQG144I is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 221,184 bits of RAM, and 102 available I/O pins in a 144-pin TQFP package. The -2 speed grade operates from a 1.14 V to 1.26 V supply, and verified distributor data identifies a maximum clock frequency of 375 MHz. It also provides digital clock management and PLL resources for clock generation, conditioning, and phase alignment. The XC6SLX4 combines programmable logic, block RAM, programmable I/O, and dedicated clocking resources in one reconfigurable device. An FPGA, or field-programmable gate array, is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after manufacture. FPGAs sit above fixed-function logic devices in the hardware hierarchy and are commonly used where protocols, interfaces, control logic, or product requirements must change without redesigning an ASIC. The Spartan-6 family targets cost-sensitive embedded systems, industrial controls, communications interfaces, signal processing, and general programmable-logic applications. The XC6SLX4 includes 3,840 logic cells, 221,184 bits of RAM, 102 user I/O, DCM, and PLL resources according to the supplied distributor and technical data. Its 144-pin TQFP package uses a 0.5 mm pitch and a 20 mm by 20 mm body. The industrial-temperature suffix and lead-free status are supported by the retrieved part data, but exact temperature limits, electrical timing limits, and detailed compliance certificates were not included in the source set and require confirmation from the manufacturer datasheet. The -2 designation identifies the performance grade, while TQG144I identifies the package and temperature-market ordering options. Designers must configure the FPGA using an AMD-supported device definition and ensure that every external interface uses the correct voltage, slew, drive-strength, and timing constraints. Clocking should be planned carefully because incorrect clock constraints or phase relationships can make an otherwise valid design fail post-route timing. Typical uses include industrial data acquisition, embedded communications bridges, motor and motion control, sensor aggregation, protocol conversion, and control systems with parallel or serial interfaces. The 102 available I/O pins are useful for parallel buses, while the clocking and RAM resources can support buffering, state machines, packet handling, and sampled-data paths. The device is best suited to designs that need moderate logic density and flexible field updates. A key design consideration is that FPGA interchangeability depends on the bitstream, pin constraints, supported I/O standards, timing closure, and package footprint. Before purchasing a replacement, verify the exact MPN suffix, package drawing, pinout, configuration voltage, memory initialization, and supported design tools. This page synthesizes the supplied manufacturer and distributor data with engineering guidance while avoiding unverified electrical claims.
XC6SLX4-3CPG196I - Spartan-6 LX FPGA, 3840 Cells | AMD
The AMD XC6SLX4-3CPG196I is a Spartan-6 LX field-programmable gate array with 3840 logic cells, 106 I/O, and a 196-ball CSBGA package. It uses 45 nm CMOS technology, operates from a 1.2 V core supply, and is specified for an industrial temperature range of -40 °C to 100 °C. The -3 speed grade identifies the device's performance class within the Spartan-6 LX family. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and configurable I/O blocks are programmed by the user after manufacture. Within the product hierarchy, an FPGA is a programmable logic device alongside a CPLD. Compared with a fixed-function application-specific integrated circuit, an FPGA supports configuration changes, parallel processing, custom interfaces, and design updates without requiring a new silicon mask. The XC6SLX4 balances compact logic capacity with a relatively high I/O count. Its 106 I/O positions make the 196-CSBGA configuration useful for systems requiring multiple external interfaces, control signals, data buses, or mixed signal connectivity. The 3840 logic cells allow parallelizable digital functions to be consolidated into one programmable device, reducing the number of supporting logic components in suitable designs. The 45 nm CMOS implementation places this device within the Spartan-6 LX generation of low-cost FPGAs. The supplied comparison data identifies a 1.2 V technology or supply value, while detailed operating-voltage tolerances, clock specifications, block counts, performance timing, and internal memory parameters require confirmation in the manufacturer datasheet. The CPG196 designation denotes a compact 196-ball surface-mount package, and the I suffix denotes the industrial temperature grade. Typical uses include industrial control, data acquisition, programmable logic, embedded signal processing, communications interfaces, and compact instrumentation. Because the device combines configurable logic with 106 I/O, it can consolidate parallel control, acquisition, and communication functions where deterministic real-time behavior is valuable. Its industrial temperature specification also supports factory automation and other temperature-controlled industrial environments when the complete electrical and timing requirements are satisfied. Designers should verify the pinout, power rails, decoupling, configuration interface, clock requirements, and I/O standards against the manufacturer datasheet before layout release. The 196-ball CSBGA requires a PCB footprint and assembly process capable of handling fine-pitch, bottom-terminated balls. Signal-integrity and power-integrity analysis should account for simultaneous switching across the device's 106 I/O. This page combines verified distributor data, package and family details, practical application guidance, and clearly marked data gaps to support component selection, sourcing, and design-in review.