10AS032E4F27I3LG vs 10AS048E1F29I1HG Comparison

Detailed side-by-side comparison of 10AS032E4F27I3LG by Intel and 10AS048E1F29I1HG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AS032E4F27I3LG 10AS048E1F29I1HG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,085.10 $1,920.00
Family Arria 10 SX SoC FPGA Arria 10 SX SoC FPGA
Logic Elements 320,000 480,000
Hard Processor Subsystem (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Clock Frequency 1.5 GHz Up to 1.5 GHz
Speed Grade E4 (-4, mid-tier) —
Temperature Grade Industrial (-40C to +100C) —
Package 672-pin FCBGA (F27, 27x27 mm) 780-ball FCBGA, 29x29 mm
Mounting Type Surface Mount Surface Mount (Flip-Chip BGA)
RoHS Status Compliant Compliant
Lead-Free Yes —
MSL Level [DATA_NEEDED: MSL rating per JEDEC J-STD-020] [DATA_NEEDED: MSL rating]
Process Technology 20 nm —
Transceivers Up to 24 channels, up to 14.1 Gbps (family-level) [DATA_NEEDED: transceiver count and data rate]
DSP Blocks Hardened floating-point DSP (family-level) [DATA_NEEDED: DSP block count]
Memory Interfaces DDR3 / DDR4 with hard controllers (family-level) —
Configuration Method JTAG, ASx4, FPP (family-level) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Process Node — 20 nm
Operating Temperature — -40C to +100C (Industrial)
Number of Terminals — 780
Terminal Form — Ball
Package Code — BGA
Package Shape — Square
Embedded Memory — [DATA_NEEDED: embedded RAM bits]

Datasheets & Resources

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