10AS032E4F27I3LG vs 10AS048E1F29I1HG Vergleich

Detaillierter Direktvergleich von 10AS032E4F27I3LG von Intel und 10AS048E1F29I1HG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10AS032E4F27I3LG 10AS048E1F29I1HG
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.085,10 $1.920,00
Family Arria 10 SX SoC FPGA Arria 10 SX SoC FPGA
Logic Elements 320,000 480,000
Hard Processor Subsystem (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Clock Frequency 1.5 GHz Up to 1.5 GHz
Speed Grade E4 (-4, mid-tier) —
Temperature Grade Industrial (-40C to +100C) —
Gehäuse 672-pin FCBGA (F27, 27x27 mm) 780-ball FCBGA, 29x29 mm
Montageart Surface Mount Surface Mount (Flip-Chip BGA)
RoHS-Status Compliant Compliant
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL rating per JEDEC J-STD-020] [DATA_NEEDED: MSL rating]
Process Technology 20 nm —
Transceivers Up to 24 channels, up to 14.1 Gbps (family-level) [DATA_NEEDED: transceiver count and data rate]
DSP Blocks Hardened floating-point DSP (family-level) [DATA_NEEDED: DSP block count]
Memory Interfaces DDR3 / DDR4 with hard controllers (family-level) —
Configuration Method JTAG, ASx4, FPP (family-level) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Process Node — 20 nm
Betriebstemperatur — -40C to +100C (Industrial)
Number of Terminals — 780
Terminal Form — Ball
Package Code — BGA
Package Shape — Square
Embedded Memory — [DATA_NEEDED: embedded RAM bits]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern