10AX115N4F45E3LG vs 10AX115N4F45I3LG Comparison
Detailed side-by-side comparison of 10AX115N4F45E3LG by Intel and 10AX115N4F45I3LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX115N4F45E3LG | 10AX115N4F45I3LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7,100.00 | $7,100.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,532 Kbits per M20K block) | — |
| DSP Blocks | 3,376 (variable-precision, 18x19 multipliers) | [DATA_NEEDED: DSP count] |
| Maximum User I/O Pins | 768 | — |
| Transceivers | Up to 96 channels at up to 17.4 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | — |
| Memory Interfaces | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) | — |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) | — |
| PLLs | 24 | — |
| Process Technology | TSMC 20nm | TSMC 20 nm |
| Package | 1932-ball FCBGA (F45, 45x45 mm) | 1932-BBGA, FCBGA |
| Operating Temperature | Extended (E) industrial grade per ordering code | — |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Voltage Rails | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent | — |
| Device | — | 10AX115 |
| Logic Elements | — | 1,150,000 |
| Embedded Memory (bits) | — | 68,857,856 |
| User I/O Count | — | 768 |
| Package Family | — | F45 (45 mm) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Speed Grade | — | I3 |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1932 |
| Package Code | — | BGA (FCBGA) |