10AX115N4F45E3LG vs 10AX115N4F45I3LG 비교
다음의 상세 나란히 비교: 10AX115N4F45E3LG 제조: Intel 및 10AX115N4F45I3LG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115N4F45E3LG | 10AX115N4F45I3LG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $7,100.00 | $7,100.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,532 Kbits per M20K block) | — |
| DSP Blocks | 3,376 (variable-precision, 18x19 multipliers) | [DATA_NEEDED: DSP count] |
| Maximum User I/O Pins | 768 | — |
| Transceivers | Up to 96 channels at up to 17.4 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | — |
| Memory Interfaces | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) | — |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) | — |
| PLLs | 24 | — |
| Process Technology | TSMC 20nm | TSMC 20 nm |
| 패키지 | 1932-ball FCBGA (F45, 45x45 mm) | 1932-BBGA, FCBGA |
| 동작 온도 | Extended (E) industrial grade per ordering code | — |
| RoHS 상태 | Compliant | Compliant |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | — |
| Voltage Rails | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent | — |
| Device | — | 10AX115 |
| Logic Elements | — | 1,150,000 |
| Embedded Memory (bits) | — | 68,857,856 |
| User I/O Count | — | 768 |
| Package Family | — | F45 (45 mm) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Speed Grade | — | I3 |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1932 |
| Package Code | — | BGA (FCBGA) |