10AX115N4F45E3LG vs 10AX115N4F45I3LG Vergleich
Detaillierter Direktvergleich von 10AX115N4F45E3LG von Intel und 10AX115N4F45I3LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N4F45E3LG | 10AX115N4F45I3LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.100,00 | $7.100,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,532 Kbits per M20K block) | — |
| DSP Blocks | 3,376 (variable-precision, 18x19 multipliers) | [DATA_NEEDED: DSP count] |
| Maximum User I/O Pins | 768 | — |
| Transceivers | Up to 96 channels at up to 17.4 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | — |
| Memory Interfaces | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) | — |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) | — |
| PLLs | 24 | — |
| Process Technology | TSMC 20nm | TSMC 20 nm |
| Gehäuse | 1932-ball FCBGA (F45, 45x45 mm) | 1932-BBGA, FCBGA |
| Betriebstemperatur | Extended (E) industrial grade per ordering code | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Voltage Rails | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent | — |
| Device | — | 10AX115 |
| Logic Elements | — | 1,150,000 |
| Embedded Memory (bits) | — | 68,857,856 |
| User I/O Count | — | 768 |
| Package Family | — | F45 (45 mm) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Speed Grade | — | I3 |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1932 |
| Package Code | — | BGA (FCBGA) |