10M04DCU324A7G vs 10M02DCU324A7G Comparison

Detailed side-by-side comparison of 10M04DCU324A7G by Intel and 10M02DCU324A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M04DCU324A7G 10M02DCU324A7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.85 $6.30
Family MAX 10 MAX 10
Logic Elements (LE) 4,000 2,000
Process Node 55 nm —
Core Voltage 1.2 V 1.15 V to 1.25 V
Embedded Memory (bits) 193,536 —
User Flash Memory Integrated (non-volatile configuration) Integrated (on-chip flash configuration)
Maximum User I/O 246 —
Package 324-pin UFBGA (U324) —
Mounting Type Surface Mount (BGA) Surface Mount
Ball Pitch 0.8 mm —
Speed Grade 7 —
Operating Temperature [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] —
Configuration Memory On-chip flash (instant-on, no external PROM) —
AEC-Q100 Qualification Yes (A-grade suffix) —
Lead-Free / RoHS Yes (G suffix) —
Integrated ADC Yes (12-bit SAR, multiple channels) 12-bit, 1 Msps+, successive approximation
PLL Count [DATA_NEEDED: PLL count for 10M04] —
Multipliers (18x18) [DATA_NEEDED: multiplier count for 10M04] —
Embedded Memory — 110,592 bits
User I/O Count — 160
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Operating Junction Temperature — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Process Technology — 55 nm embedded flash (TSMC)
RoHS Status — Compliant
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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