10M04DCU324A7G - MAX 10 FPGA 4K LE UFBGA-324 | Intel
MPN: 10M04DCU324A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.16 | $17.16 |
| 10 | $15.45 | $154.50 |
| 100 | $13.2 | $1,320.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.85 | $9,850.00 |
Drop-in alternatives for 10M04DCU324A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M04DCU324I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M04DCU324C8G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M04DAU324I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$13.5 / Unit
View Datasheet →10M04DAU324C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →10M02DCU324A7G
✅ Drop-In✓ In Stock
$6.3 / Unit
View Datasheet →10M04DCU324A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Process Node | 55 nm |
| Core Voltage | 1.2 V |
| Embedded Memory (bits) | 193,536 |
| User Flash Memory | Integrated (non-volatile configuration) |
| Maximum User I/O | 246 |
| Package | 324-pin UFBGA (U324) |
| Mounting Type | Surface Mount (BGA) |
| Ball Pitch | 0.8 mm |
| Speed Grade | 7 |
| Configuration Memory | On-chip flash (instant-on, no external PROM) |
| AEC-Q100 Qualification | Yes (A-grade suffix) |
| Lead-Free / RoHS | Yes (G suffix) |
| Integrated ADC | Yes (12-bit SAR, multiple channels) |
10M04DCU324A7G 324-pin ufbga (u324) Pin Configuration Guide
Complete pinout information for 10M04DCU324A7G (324-pin ufbga (u324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DCU324A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04DCU324A7G is suitable for 6 applications: Automotive Driver-Assistance (ADAS) Modules, Industrial Motor Control, Factory Automation I/O Bridge, Video Bridging and Display Aggregation, Industrial IoT Edge Node, Automotive Body Electronics.
Automotive Driver-Assistance (ADAS) Modules
The 10M04DCU324A7G's AEC-Q100 qualification and 4,000 logic elements make it well suited to automotive ADAS subsystems such as rear-view camera processing, ultrasonic sensor aggregation, and basic sensor-fusion glue logic. Its integrated 12-bit ADC handles analog sensor signals (temperature, current, position) directly, eliminating an external ADC and reducing BOM cost. The 246 user I/Os comfortably accommodate multiple LVCMOS camera channels plus CAN/LIN transceivers. On-chip flash enables instant-on behavior at vehicle power-up (cold-crank), critical for ADAS modules that must be ready before the engine stabilizes.
Recommended
Industrial Motor Control
The 10M04DCU324A7G delivers enough logic and memory to host sensorless FOC motor control loops on a single chip, with 18x18 multipliers accelerating Park/Clarke transforms. The 324-pin UFBGA package provides abundant I/O for parallel ADC sampling of phase currents, encoder inputs (QEP), and PWM outputs to gate drivers. The integrated 12-bit ADC can monitor motor parameters directly when higher-resolution external ADCs are not justified. Industrial -40C to +100C operation and AEC-Q100 qualification together provide extra margin in harsh factory environments.
Recommended
Factory Automation I/O Bridge
In factory automation, the 10M04DCU324A7G serves as a protocol-bridging glue logic device between industrial Ethernet (EtherCAT, PROFINET), RS-485, and discrete digital I/O. Its 246 I/Os support multiple fieldbus interfaces concurrently, while the embedded 193 Kbit memory buffers bursts between asynchronous domains. Quartus Prime Nios II soft-core support allows adding a small CPU for protocol handling without an external MCU. The AEC-Q100 grade and extended temperature range are overkill for indoor panels but useful for cabinet-edge mounted controllers.
Recommended
Video Bridging and Display Aggregation
With 4,000 LEs, the 10M04DCU324A7G can bridge between MIPI-CSI, parallel RGB, and LVDS display sources, performing basic timing conversion, color-space conversion, and limited scaling. Its 246 I/Os handle wide parallel video buses without external muxing. The on-chip flash supports fast field firmware updates for evolving display standards. Automotive-grade qualification suits in-vehicle infotainment and head-up display (HUD) aggregation nodes. For higher resolutions (1080p+), consider the 10M08 or 10M16 siblings.
Recommended
Industrial IoT Edge Node
The 10M04DCU324A7G is ideal for industrial IoT edge nodes that aggregate sensor data and pre-process it before forwarding to cloud or PLC. Its integrated 12-bit ADC reads analog sensors directly, while 246 I/Os handle digital sensors, GPIO, and a UART/SPI/I2C host MCU link. Nios II soft-core support enables running lightweight RTOS firmware, and on-chip flash ensures instant boot. AEC-Q100 and industrial temperature grades suit both factory-floor and outdoor deployments. Power consumption is moderate; static draw is dominated by the on-chip flash.
Recommended
Automotive Body Electronics
In automotive body modules (BCM), the 10M04DCU324A7G provides the multi-channel glue logic needed to coordinate lighting drivers, door modules, seat controllers, and HVAC actuators via LIN/CAN buses. The 4,000 LEs support multiple state machines for body control logic, while 246 I/Os manage distributed load drivers and PWM channels. AEC-Q100 grade and automotive temperature range ensure reliability under hood-and-cabin thermal swings. On-chip flash enables over-the-air firmware updates for evolving feature sets.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DCU324A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DCU324I7G | 10M04DCU324C8G | 10M04DAU324I7G | 10M04DAU324C8G | 10M02DCU324A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin UFBGA (U324) | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UBGA (U324) - same footprint | 324-pin UBGA (U324) - same footprint | 324-pin UFBGA (U324) - same |
| Logic Elements (LE) | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 | 2,000 (-50%) |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 8 (faster) | 7 |
| Temperature Grade | Automotive (AEC-Q100, A-grade) | Industrial (-40C to +100C, no AEC-Q100) | Commercial (no AEC-Q100) | Industrial (I-grade, no AEC-Q100) | Commercial (no AEC-Q100) | Automotive (AEC-Q100, A-grade) |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 | [DATA_NEEDED] |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Configuration Memory | On-chip flash (instant-on) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- AEC-Q100 automotive qualification with A-grade temperature screening (vs 10M04DCU324I7G)
- Higher logic capacity (4,000 LE) within the same MAX 10 family (vs 10M02DCU324A7G)
- Lower cost positioning vs higher-density MAX 10 siblings (vs 10M08DAU324C8G)
Design Notes
The UFBGA-324 package requires a well-designed PCB thermal dissipation strategy. Estimated: at 1.2 V core, 4,000 LE utilization at ~50% toggle rate and 100 MHz internal clock, typical junction-to-ambient thermal resistance (theta_JA) for a 4-layer JEDEC board is around 25-35 C/W. For automotive under-hood placements, use thermal vias under the BGA and inner copper pours to keep Tj below 100 C; for industrial cabinet placements a 4-layer FR-4 board with GND plane is usually adequate.
Use a 4-layer or higher PCB stack-up with continuous GND and PWR planes under the U324 BGA. The 0.8 mm ball pitch requires laser-drilled microvias (typical 0.1 mm hole, 0.2 mm pad) for inner-layer fan-out. Match trace lengths within each LVDS pair to within 50 mil (1.27 mm). Place 0.1 uF decoupling capacitors on every VCCIO and VCCINT pin pair as close as physically possible to the package. Use Intel's U324 reference design BGA escape pattern as the starting point for fan-out.
Do not assume the 'A' suffix only denotes temperature grade - it also implies AEC-Q100 qualification, which requires full PPAP documentation. The C-grade variants (commercial) lack automotive qualification and should not be substituted in safety-critical designs. Quartus Prime pin assignments must be exported to the PCB tool using the matching U324 package symbol; mixing U324 and U169 ball maps will cause routing errors. The on-chip flash is rated for a limited number of program/erase cycles - design boot firmware to minimize reconfiguration events.
Compliance Information
RoHS compliant and lead-free per G suffix in MPN. AEC-Q100 automotive qualified per A-grade suffix. Halogen-free status not explicitly stated in retrieved data. Conflict-minerals compliance per Intel supply chain disclosure.
