10M04DCU324A7G vs 10M02DCU324A7G Vergleich

Detaillierter Direktvergleich von 10M04DCU324A7G von Intel und 10M02DCU324A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M04DCU324A7G 10M02DCU324A7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,85 $6,30
Family MAX 10 MAX 10
Logic Elements (LE) 4,000 2,000
Process Node 55 nm —
Core Voltage 1.2 V 1.15 V to 1.25 V
Embedded Memory (bits) 193,536 —
User Flash Memory Integrated (non-volatile configuration) Integrated (on-chip flash configuration)
Maximum User I/O 246 —
Gehäuse 324-pin UFBGA (U324) —
Montageart Surface Mount (BGA) Surface Mount
Ball Pitch 0.8 mm —
Speed Grade 7 —
Betriebstemperatur [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] —
Configuration Memory On-chip flash (instant-on, no external PROM) —
AEC-Q100 Qualification Yes (A-grade suffix) —
Lead-Free / RoHS Yes (G suffix) —
Integrated ADC Yes (12-bit SAR, multiple channels) 12-bit, 1 Msps+, successive approximation
PLL Count [DATA_NEEDED: PLL count for 10M04] —
Multipliers (18x18) [DATA_NEEDED: multiplier count for 10M04] —
Embedded Memory — 110,592 bits
User I/O Count — 160
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Betriebs-Sperrschichttemperatur — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Process Technology — 55 nm embedded flash (TSMC)
RoHS-Status — Compliant
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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