10M04SAM153I7G vs 10M08SAM153I7G Comparison

Detailed side-by-side comparison of 10M04SAM153I7G by Intel and 10M08SAM153I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M04SAM153I7G 10M08SAM153I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.20 $7.40
Series MAX 10 (10M04) —
Family MAX® 10 FPGA MAX 10
Logic Elements (LEs) 4,000 —
Embedded Memory (bits) 193,536 —
User I/O Count 112 —
Process Technology 55 nm (embedded flash, TSMC) —
Core Voltage 1.2 V —
I/O Voltage Support 3.0 V / 3.3 V LVCMOS —
Package 153-ball MBGA (Micro FineLine BGA) 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch
Package Pitch [DATA_NEEDED: package ball pitch] —
Operating Temperature -40 °C to +100 °C (industrial) -40 °C to +100 °C (Industrial)
Configuration Method On-die flash, instant-on Internal flash, JTAG
PLLs [DATA_NEEDED: PLL count] 4 (periphery)
Multiplier Blocks (18×18) [DATA_NEEDED: multiplier count] —
ADC Block [DATA_NEEDED: ADC presence on this density] 12-bit, 1 MSPS (1 hard IP block)
User Flash [DATA_NEEDED: user flash size] —
RoHS Status Compliant Compliant
Lead-Free Yes —
Mounting Type Surface Mount Surface Mount (BGA)
Logic Elements (LE) — 8,000
Embedded Memory (M9K blocks) — 378 Kbit
Maximum User I/O — 112
DSP Blocks (18x18 multipliers) — 24
Speed Grade — I7 (industrial, 7)
On-die Flash Configuration — Yes (instant-on, dual-boot)
Global Clocks — 20
User Flash Memory (UFM) — Up to 736 Kbyte
MSL Level — 3 (168 hours)

Datasheets & Resources

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