10M04SAM153I7G vs 10M08SAM153I7G 对比
详细并排对比 10M04SAM153I7G 出自 Intel 和 10M08SAM153I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M04SAM153I7G | 10M08SAM153I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.20 | $7.40 |
| Series | MAX 10 (10M04) | — |
| Family | MAX® 10 FPGA | MAX 10 |
| Logic Elements (LEs) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | — |
| User I/O Count | 112 | — |
| Process Technology | 55 nm (embedded flash, TSMC) | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage Support | 3.0 V / 3.3 V LVCMOS | — |
| 封装 | 153-ball MBGA (Micro FineLine BGA) | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch |
| Package Pitch | [DATA_NEEDED: package ball pitch] | — |
| 工作温度 | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (Industrial) |
| Configuration Method | On-die flash, instant-on | Internal flash, JTAG |
| PLLs | [DATA_NEEDED: PLL count] | 4 (periphery) |
| Multiplier Blocks (18×18) | [DATA_NEEDED: multiplier count] | — |
| ADC Block | [DATA_NEEDED: ADC presence on this density] | 12-bit, 1 MSPS (1 hard IP block) |
| User Flash | [DATA_NEEDED: user flash size] | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | 378 Kbit |
| Maximum User I/O | — | 112 |
| DSP Blocks (18x18 multipliers) | — | 24 |
| Speed Grade | — | I7 (industrial, 7) |
| On-die Flash Configuration | — | Yes (instant-on, dual-boot) |
| Global Clocks | — | 20 |
| User Flash Memory (UFM) | — | Up to 736 Kbyte |
| MSL 等级 | — | 3 (168 hours) |