10M04SAM153I7G vs 10M08SAM153I7G Vergleich
Detaillierter Direktvergleich von 10M04SAM153I7G von Intel und 10M08SAM153I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M04SAM153I7G | 10M08SAM153I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,20 | $7,40 |
| Series | MAX 10 (10M04) | — |
| Family | MAX® 10 FPGA | MAX 10 |
| Logic Elements (LEs) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | — |
| User I/O Count | 112 | — |
| Process Technology | 55 nm (embedded flash, TSMC) | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage Support | 3.0 V / 3.3 V LVCMOS | — |
| Gehäuse | 153-ball MBGA (Micro FineLine BGA) | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch |
| Package Pitch | [DATA_NEEDED: package ball pitch] | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (Industrial) |
| Configuration Method | On-die flash, instant-on | Internal flash, JTAG |
| PLLs | [DATA_NEEDED: PLL count] | 4 (periphery) |
| Multiplier Blocks (18×18) | [DATA_NEEDED: multiplier count] | — |
| ADC Block | [DATA_NEEDED: ADC presence on this density] | 12-bit, 1 MSPS (1 hard IP block) |
| User Flash | [DATA_NEEDED: user flash size] | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | 378 Kbit |
| Maximum User I/O | — | 112 |
| DSP Blocks (18x18 multipliers) | — | 24 |
| Speed Grade | — | I7 (industrial, 7) |
| On-die Flash Configuration | — | Yes (instant-on, dual-boot) |
| Global Clocks | — | 20 |
| User Flash Memory (UFM) | — | Up to 736 Kbyte |
| MSL-Level | — | 3 (168 hours) |