10M25DAF484A7P vs 10M08DAF484C8G Comparison

Detailed side-by-side comparison of 10M25DAF484A7P by Intel and 10M08DAF484C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M25DAF484A7P 10M08DAF484C8G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $54.75 $27.65
Series MAX 10 —
Logic Elements 25,000 —
Configurable Logic Blocks (CLBs) 1,563 —
Process Technology 55 nm non-volatile 55 nm
Embedded Memory 1,728 Kbits 387,072 bits (378 Kbits)
Maximum User I/O 360 250
Package 484-ball Plastic BGA (S-PBGA-B484) 484-ball FBGA (FineLine BGA)
Package Code BGA —
Terminal Form Ball —
Temperature Grade Automotive (-40 C to +125 C TJ) —
Speed Grade A7 -C8
Configuration Internal dual-boot flash (no external PROM) Internal flash, dual-configuration, RSU support
On-chip ADC 1 x 12-bit, 1 MSPS —
PLLs 2 (general-purpose) 2
DSP Blocks Up to 25 (18x18 MAC) Yes
Supply Voltage 3.3 V or 1.8 V single supply —
Mounting Type Surface Mount —
RoHS Status Compliant Compliant
Family — MAX 10
Logic Elements (LE) — 8000
User Flash — 1,540 Kbits
ADC — 8-channel, 12-bit
Core Voltage — 1.2 V
I/O Bank Voltage — 1.2 V to 3.3 V
Operating Junction Temperature — -40 C to +100 C (industrial)

Datasheets & Resources

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