10M25DAF484A7P vs 10M25DAF484C8G Comparison

Detailed side-by-side comparison of 10M25DAF484A7P by Intel and 10M25DAF484C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M25DAF484A7P 10M25DAF484C8G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $54.75 $50.00
Series MAX 10 —
Logic Elements 25,000 25,000
Configurable Logic Blocks (CLBs) 1,563 —
Process Technology 55 nm non-volatile 55 nm CMOS
Embedded Memory 1,728 Kbits —
Maximum User I/O 360 —
Package 484-ball Plastic BGA (S-PBGA-B484) 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch
Package Code BGA —
Terminal Form Ball —
Temperature Grade Automotive (-40 C to +125 C TJ) —
Speed Grade A7 -8
Configuration Internal dual-boot flash (no external PROM) —
On-chip ADC 1 x 12-bit, 1 MSPS —
PLLs 2 (general-purpose) Yes (up to 4 analog PLLs per device)
DSP Blocks Up to 25 (18x18 MAC) —
Supply Voltage 3.3 V or 1.8 V single supply —
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant
Family — MAX 10
Embedded Memory (Kbits) — 1638
User I/O Count — 360
Core Supply Voltage (VCCINT) — 1.2 V (1.15 V min / 1.25 V max)
Operating Temperature — 0 °C to 85 °C (Commercial)
Configuration Memory — On-chip dual-configuration flash
ADC — Integrated 12-bit ADC (where enabled)
MSL Level — MSL3
Number of I/O Banks — 8 (per F484 pinout)

Datasheets & Resources

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