10M25DAF484A7P vs 10M25DAF484C8G Vergleich
Detaillierter Direktvergleich von 10M25DAF484A7P von Intel und 10M25DAF484C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484A7P | 10M25DAF484C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $54,75 | $50,00 |
| Series | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Configurable Logic Blocks (CLBs) | 1,563 | — |
| Process Technology | 55 nm non-volatile | 55 nm CMOS |
| Embedded Memory | 1,728 Kbits | — |
| Maximum User I/O | 360 | — |
| Gehäuse | 484-ball Plastic BGA (S-PBGA-B484) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Temperature Grade | Automotive (-40 C to +125 C TJ) | — |
| Speed Grade | A7 | -8 |
| Configuration | Internal dual-boot flash (no external PROM) | — |
| On-chip ADC | 1 x 12-bit, 1 MSPS | — |
| PLLs | 2 (general-purpose) | Yes (up to 4 analog PLLs per device) |
| DSP Blocks | Up to 25 (18x18 MAC) | — |
| Versorgungsspannung | 3.3 V or 1.8 V single supply | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Family | — | MAX 10 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Betriebstemperatur | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| MSL-Level | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |