10M50DAF256I7G vs 10M50DAF484I7G Comparison
Detailed side-by-side comparison of 10M50DAF256I7G by Intel and 10M50DAF484I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DAF256I7G | 10M50DAF484I7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $155.20 | $58.20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Package | 256-LBGA (17 mm x 17 mm) | 484-ball FBGA (F484) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | 12-bit, 1 MSPS, up to 18 channels |
| PLLs | On-chip (4 typical for 10M50 family) | 4 |
| Core Voltage | 1.2 V | — |
| Operating Temperature | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 55 nm embedded flash | TSMC 55 nm |
| Mounting Type | Surface Mount (BGA) | Surface Mount (FBGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| RoHS Status | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | Single-chip (no external boot device required) |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| DSP Blocks | — | 144 (18x18 multipliers) |
| MSL Level | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |