10M50DAF256I7G vs 10M50DAF484I7G 比較
詳細な並列比較: 10M50DAF256I7G メーカー: Intel および 10M50DAF484I7G メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | 10M50DAF256I7G | 10M50DAF484I7G |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $155.20 | $58.20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| パッケージ | 256-LBGA (17 mm x 17 mm) | 484-ball FBGA (F484) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | 12-bit, 1 MSPS, up to 18 channels |
| PLLs | On-chip (4 typical for 10M50 family) | 4 |
| Core Voltage | 1.2 V | — |
| 動作温度 | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 55 nm embedded flash | TSMC 55 nm |
| 実装タイプ | Surface Mount (BGA) | Surface Mount (FBGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| RoHS ステータス | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | Single-chip (no external boot device required) |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| DSP Blocks | — | 144 (18x18 multipliers) |
| MSLレベル | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |