10M50DAF484I7G vs 10M50DCF484I6G Comparison

Detailed side-by-side comparison of 10M50DAF484I7G by Intel and 10M50DCF484I6G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DAF484I7G 10M50DCF484I6G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $52.75
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded User Flash (bits) 1,677,312 (dual configuration) —
User I/O Count 360 —
Package 484-ball FBGA (F484) 484-ball FineLine BGA (F484)
Package Pitch 1.0 mm —
Package Body Size 23 x 23 mm —
Process Technology TSMC 55 nm —
Supply Voltage - Core 1.2 V 1.2 V
Operating Temperature Grade Industrial (-40C to +100C) —
On-die Configuration Flash Yes (dual-boot) —
Integrated ADC 12-bit, 1 MSPS, up to 18 channels —
DSP Blocks 144 (18x18 multipliers) —
PLLs 4 —
Configuration Mode Single-chip (no external boot device required) —
Mounting Type Surface Mount (FBGA) Surface Mount (BGA)
MSL Level 3 (per JEDEC J-STD-020) —
RoHS Status Compliant Compliant
Lead-free / Halogen-free Yes / Yes —
Logic Elements — 50,000
Adaptive Logic Modules (ALMs) — 25,000
Embedded Memory (RAM) — 1,638 Kbit
User Flash — 512 Kbyte (4,096 Kbit)
Total Embedded Memory — 2,140 Kbit (RAM + UFM)
18x18 Multipliers — 144
General-Purpose PLLs — 4
Global Clock Networks — 20
Hard PCIe Gen2 Controllers — 1 (x1)
On-chip ADC — 12-bit, 1 Msps SAR, up to 18 channels
User I/O Pins — 360
Supply Voltage - I/O — 1.2 V to 3.3 V
Operating Junction Temperature — -40C to +100C (industrial)
Configuration Memory — On-chip non-volatile (dual image)

Datasheets & Resources

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