10M50DAF484I7G vs 10M50DCF484I6G Comparaison
Comparaison détaillée côte à côte de 10M50DAF484I7G par Intel et 10M50DCF484I6G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M50DAF484I7G | 10M50DCF484I6G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $58,20 | $52,75 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Boîtier | 484-ball FBGA (F484) | 484-ball FineLine BGA (F484) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | — |
| Supply Voltage - Core | 1.2 V | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | — |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | — |
| Configuration Mode | Single-chip (no external boot device required) | — |
| Type de montage | Surface Mount (FBGA) | Surface Mount (BGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) | — |
| Statut RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Logic Elements | — | 50,000 |
| Adaptive Logic Modules (ALMs) | — | 25,000 |
| Embedded Memory (RAM) | — | 1,638 Kbit |
| User Flash | — | 512 Kbyte (4,096 Kbit) |
| Total Embedded Memory | — | 2,140 Kbit (RAM + UFM) |
| 18x18 Multipliers | — | 144 |
| General-Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Hard PCIe Gen2 Controllers | — | 1 (x1) |
| On-chip ADC | — | 12-bit, 1 Msps SAR, up to 18 channels |
| User I/O Pins | — | 360 |
| Supply Voltage - I/O | — | 1.2 V to 3.3 V |
| Température de jonction en fonctionnement | — | -40C to +100C (industrial) |
| Configuration Memory | — | On-chip non-volatile (dual image) |