10M50DAF484I7G vs 10M50DCF484I6G Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7G von Intel und 10M50DCF484I6G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7G 10M50DCF484I6G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $58,20 $52,75
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded User Flash (bits) 1,677,312 (dual configuration) —
User I/O Count 360 —
Gehäuse 484-ball FBGA (F484) 484-ball FineLine BGA (F484)
Package Pitch 1.0 mm —
Package Body Size 23 x 23 mm —
Process Technology TSMC 55 nm —
Supply Voltage - Core 1.2 V 1.2 V
Operating Temperature Grade Industrial (-40C to +100C) —
On-die Configuration Flash Yes (dual-boot) —
Integrated ADC 12-bit, 1 MSPS, up to 18 channels —
DSP Blocks 144 (18x18 multipliers) —
PLLs 4 —
Configuration Mode Single-chip (no external boot device required) —
Montageart Surface Mount (FBGA) Surface Mount (BGA)
MSL-Level 3 (per JEDEC J-STD-020) —
RoHS-Status Compliant Compliant
Lead-free / Halogen-free Yes / Yes —
Logic Elements — 50,000
Adaptive Logic Modules (ALMs) — 25,000
Embedded Memory (RAM) — 1,638 Kbit
User Flash — 512 Kbyte (4,096 Kbit)
Total Embedded Memory — 2,140 Kbit (RAM + UFM)
18x18 Multipliers — 144
General-Purpose PLLs — 4
Global Clock Networks — 20
Hard PCIe Gen2 Controllers — 1 (x1)
On-chip ADC — 12-bit, 1 Msps SAR, up to 18 channels
User I/O Pins — 360
Supply Voltage - I/O — 1.2 V to 3.3 V
Betriebs-Sperrschichttemperatur — -40C to +100C (industrial)
Configuration Memory — On-chip non-volatile (dual image)

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