10M50DCF484I6G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
MPN: 10M50DCF484I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.5 | $87.50 |
| 10 | $78.2 | $782.00 |
| 100 | $65.4 | $6,540.00 |
| 250 | $58.1 | $14,525.00 |
| 500 | $52.75 | $26,375.00 |
Drop-in alternatives for 10M50DCF484I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DCF484C8G
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View Datasheet →10M50DCF484C7G
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View Datasheet →10M50DAF484I7G
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$58.2 / Unit
View Datasheet →10M50DAF484C7G
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$65.8 / Unit
View Datasheet →10M40DCF484I7G
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View Datasheet →10M50DCF484I6G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 FPGA |
| Logic Elements | 50,000 |
| Adaptive Logic Modules (ALMs) | 25,000 |
| Embedded Memory (RAM) | 1,638 Kbit |
| User Flash | 512 Kbyte (4,096 Kbit) |
| Total Embedded Memory | 2,140 Kbit (RAM + UFM) |
| 18x18 Multipliers | 144 |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Hard PCIe Gen2 Controllers | 1 (x1) |
| On-chip ADC | 12-bit, 1 Msps SAR, up to 18 channels |
| User I/O Pins | 360 |
| Supply Voltage - Core | 1.2 V |
| Supply Voltage - I/O | 1.2 V to 3.3 V |
| Operating Junction Temperature | -40C to +100C (industrial) |
| Package | 484-ball FineLine BGA (F484) |
| Configuration Memory | On-chip non-volatile (dual image) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M50DCF484I6G 484-ball fineline bga (f484) Pin Configuration Guide
Complete pinout information for 10M50DCF484I6G (484-ball fineline bga (f484) package) with 360 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DCF484I6G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 360 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DCF484I6G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Aggregation, Automotive Infotainment Bridge, Sensor Aggregation Front-End, Low-Cost ASIC Replacement and Prototyping.
Industrial Motor Control
The 10M50DCF484I6G fits industrial motor control by integrating 50K logic elements, four PLLs, 144 DSP multipliers, and a 12-bit 1 Msps ADC into one BGA. The on-chip ADC samples current and back-EMF feedback without external analog front-ends; 360 user I/Os drive PWM channels and quadrature encoder inputs for multi-axis servo loops. The industrial -40C to +100C junction range tolerates factory cabinet temperatures while the dual-configuration flash supports remote firmware updates. Quartus Prime Qsys shortens design time by exposing the PCIe Gen2 hard IP and DDR3 controller to user logic.
Recommended
Factory Automation I/O Expansion
The 10M50DCF484I6G is well suited to factory I/O expansion because its 360 user I/Os in the F484 package accommodate dozens of digital inputs, opto-isolated outputs, RS-485 transceivers, and encoder channels on a single chip. The integrated 12-bit ADC handles analog sensor aggregation (temperature, pressure, flow) alongside digital logic, while hard IP for I2C, SPI, and UART reduces soft-IP footprint. Dual-configuration flash supports fail-safe firmware updates over Modbus or EtherCAT without production downtime.
Recommended
Video Bridging and Display Aggregation
In video bridging the 10M50DCF484I6G provides enough logic (50K LE), memory (1,638 Kbit RAM), and multipliers (144 18x18 blocks) to convert between camera interfaces such as MIPI CSI-2, LVDS, and parallel RGB. The 360 I/Os of the F484 BGA support wide parallel buses plus multiple I2C/SPI control channels to image sensors. The integrated ADC can monitor backlight current or temperature-compensate display panels. The 484-ball FineLine BGA also allows clean break-out for high-speed differential pairs required by MIPI and LVDS links.
Recommended
Automotive Infotainment Bridge
For automotive infotainment bridging, the 10M50DAF484I7G variant of the same family is preferred because it is rated -40C to +125C junction and meets AEC-Q100 requirements; the 10M50DCF484I6G can serve development and pre-production prototyping. Both provide hard PCIe Gen2 and DDR3 controller IP, eliminating soft-IP latency. The 50K LE budget accommodates protocol translation between vehicle Ethernet, CAN-FD, and display-side LVDS while the user flash stores configuration and calibration data.
Recommended
Sensor Aggregation Front-End
The 10M50DCF484I6G fits sensor aggregation front-ends because its integrated 12-bit 1 Msps ADC accepts up to 18 single-ended analog channels directly, eliminating an external ADC for many multi-sensor designs. Combined with 50K logic elements and 1,638 Kbit RAM, the device buffers and pre-processes samples from thermocouples, strain gauges, and 4-20 mA loops before forwarding to a host MCU over SPI, UART, or PCIe. The industrial temperature grade supports outdoor and factory deployments.
Recommended
Low-Cost ASIC Replacement and Prototyping
The 10M50DCF484I6G is commonly used as a low-cost ASIC replacement because of its instant-on capability from embedded flash (< 1 ms user I/O activation) and integrated analog blocks, eliminating the boot PROM and external ADC of legacy SRAM FPGAs. Engineers can prototype designs on the F484 development board and migrate to the smaller F256 or F81 packages in the same MAX 10 family for cost-down. Quartus Prime and the MAX 10 device family IP catalog shorten design cycles compared to ASIC NRE flows.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF484I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DCF484C8G | 10M50DCF484C7G | 10M50DAF484I7G | 10M50DAF484C7G | 10M40DCF484I7G |
|---|---|---|---|---|---|---|
| Package | 484-ball F484 FineLine BGA | 484-ball F484 FineLine BGA (same) | 484-ball F484 FineLine BGA (same) | 484-ball F484 FineLine BGA (same) | 484-ball F484 FineLine BGA (same) | 484-ball F484 FineLine BGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 |
| Embedded RAM | 1,638 Kbit | 1,638 Kbit | 1,638 Kbit | 1,638 Kbit | 1,638 Kbit | 1,260 Kbit |
| Operating Junction Temperature | -40C to +100C (industrial I6) | 0C to +85C (commercial C8) | 0C to +85C (commercial C7) | -40C to +125C (automotive I7) | 0C to +85C (automotive family, C7) | -40C to +100C (industrial I7) |
| Speed Grade | -6 (I6) | -8 (C8) | -7 (C7) | -7 (I7) | -7 (C7) | -7 (I7) |
| User I/O | 360 | 360 | 360 | 360 | 360 | 360 |
| Automotive Grade (AEC-Q100) | No (industrial family) | No | No | Yes | Yes | No |
| On-chip ADC | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps |
Key Differentiators
- Industrial-grade temperature rating with on-chip ADC and non-volatile configuration (vs 10M50DCF484C8G)
- Higher speed grade (-6) than the C7/C8 ordering codes (vs 10M50DCF484C7G)
- Industrial-grade variant vs automotive-grade variant (vs 10M50DAF484I7G)
- Higher logic-element count than the 40K LE alternative (vs 10M40DCF484I7G)
Design Notes
The 484-ball F484 FineLine BGA has a 1.0 mm ball pitch and requires at least four PCB layers with continuous power and ground planes to maintain signal integrity on high-speed LVDS/MIPI routes. Microvia and any-layer-via stack-ups are recommended; through-via stubs degrade performance above 500 MHz. Per Intel MAX 10 hardware design guidelines, route all high-speed differential pairs over a solid ground reference and avoid splits under BGA break-out regions.
MAX 10 devices require a power-on sequence that ramps the 1.2 V core supply before the I/O supplies; consult the MAX 10 Device Family Pin Connection Guidelines for the exact ramp-order requirement. A 100 nF decoupling capacitor must be placed within 1 mm of each VCCIO/VCC/VCCA power ball. Estimated: at 50% toggle activity on 360 I/Os at 100 MHz, core current approaches 500 mA; budget for at least 2 A on the 1.2 V regulator with 5% tolerance.
The F484 BGA exposes its die through a thermal pad array that should be soldered to a copper pad with thermal vias for heat extraction. Estimated: with 1.5 W typical power dissipation and the F484 theta-JA of approximately 12 C/W (still air, JEDEC test board), junction rises roughly 18C above ambient at 25C; design the enclosure for adequate airflow to keep junction below +100C. Use the on-chip temperature-sensing diode to verify thermal margins in production.
Do not leave MAX 10 user I/O pins floating - unused pins must be configured as tri-stated outputs driving ground or as input pins with weak pull-up, per the Pin Connection Guidelines. The JTAG TCK pin requires a 10 kohm pull-down if JTAG is not used. Confirmed bitstream-incompatibility between DC (industrial) and DA (automotive) variants exists for some IP cores - regenerate the Quartus Prime programming file when migrating between families, even when pinout matches.
Compliance Information
RoHS and REACH compliance confirmed per Intel/Altera MAX 10 product environmental compliance documentation. The DC family is NOT AEC-Q100 qualified - choose the MAX 10 DA family (10M50DAF484I7G) for automotive applications requiring AEC-Q100.
