10M50DAF484I7G vs 10M50DCF484I6G Comparación
Comparación detallada lado a lado de 10M50DAF484I7G por Intel y 10M50DCF484I6G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M50DAF484I7G | 10M50DCF484I6G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,20 | $52,75 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Encapsulado | 484-ball FBGA (F484) | 484-ball FineLine BGA (F484) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | — |
| Supply Voltage - Core | 1.2 V | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | — |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | — |
| Configuration Mode | Single-chip (no external boot device required) | — |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount (BGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Logic Elements | — | 50,000 |
| Adaptive Logic Modules (ALMs) | — | 25,000 |
| Embedded Memory (RAM) | — | 1,638 Kbit |
| User Flash | — | 512 Kbyte (4,096 Kbit) |
| Total Embedded Memory | — | 2,140 Kbit (RAM + UFM) |
| 18x18 Multipliers | — | 144 |
| General-Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Hard PCIe Gen2 Controllers | — | 1 (x1) |
| On-chip ADC | — | 12-bit, 1 Msps SAR, up to 18 channels |
| User I/O Pins | — | 360 |
| Supply Voltage - I/O | — | 1.2 V to 3.3 V |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Memory | — | On-chip non-volatile (dual image) |