10M50DAF484I7P vs 10M50DAF256I7G Comparison

Detailed side-by-side comparison of 10M50DAF484I7P by Intel and 10M50DAF256I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DAF484I7P 10M50DAF256I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $112.00 $155.20
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Package 484-ball FineLine BGA (F484) 256-LBGA (17 mm x 17 mm)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) On-chip (4 typical for 10M50 family)
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Operating Temperature -40C to +100C (Tj, industrial) -40C to +100C (Industrial)
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS Status Compliant Compliant
Family — MAX 10
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (M9K bits) — 1,677,312
DSP Blocks (18 x 18 multipliers) — 4
Maximum User I/O — 178
Configuration Memory — Internal non-volatile flash (dual-boot)
Integrated ADC — 12-bit SAR, up to 17 analog inputs
Core Voltage — 1.2 V
Process Technology — TSMC 55 nm embedded flash
Mounting Type — Surface Mount (BGA)
Tray Quantity — 90 per tray (typical for 256-BGA)
Configuration Mode — Internal flash (instant-on)

Datasheets & Resources

Browse All Products Create BOM Request Quote