10M50DAF484I7P vs 10M50DAF256I7G Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7P von Intel und 10M50DAF256I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7P 10M50DAF256I7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $112,00 $155,20
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Gehäuse 484-ball FineLine BGA (F484) 256-LBGA (17 mm x 17 mm)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) On-chip (4 typical for 10M50 family)
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Betriebstemperatur -40C to +100C (Tj, industrial) -40C to +100C (Industrial)
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS-Status Compliant Compliant
Family — MAX 10
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (M9K bits) — 1,677,312
DSP Blocks (18 x 18 multipliers) — 4
Maximum User I/O — 178
Configuration Memory — Internal non-volatile flash (dual-boot)
Integrated ADC — 12-bit SAR, up to 17 analog inputs
Core Voltage — 1.2 V
Process Technology — TSMC 55 nm embedded flash
Montageart — Surface Mount (BGA)
Tray Quantity — 90 per tray (typical for 256-BGA)
Configuration Mode — Internal flash (instant-on)

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