10M50DAF484I7P vs 10M50DAF484C7G Comparison

Detailed side-by-side comparison of 10M50DAF484I7P by Intel and 10M50DAF484C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DAF484I7P 10M50DAF484C7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $112.00 $65.80
Product Family MAX 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Package 484-ball FineLine BGA (F484) 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 2
Global Clock Networks 20 [DATA_NEEDED: global clocks count]
Speed Grade 7 (slowest industrial bin, highest margin) —
Operating Temperature -40C to +100C (Tj, industrial) 0 C to +85 C (commercial grade, C7 speed)
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS Status Compliant Compliant
Product Type — FPGA (Field-Programmable Gate Array)
Series — MAX 10
Logic Elements — 50,000
Embedded Memory — 1,677,312 bits (approximately 1.6 Mbit)
Embedded 18x18 Multipliers — 312
User Flash Memory — [DATA_NEEDED: user flash bits]
Number of User I/O — 360
Supply Voltage — 1.2 V core (VCCINT)
Mounting Type — Surface Mount
Configuration Memory — Non-volatile embedded flash (dual-configuration)
ADC — Integrated 12-bit SAR, up to 17 channels
Process Technology — 55 nm embedded flash CMOS
MSL Level — 3

Datasheets & Resources

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