10M50DAF484I7P vs 10M50DAF484C7G Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7P von Intel und 10M50DAF484C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7P 10M50DAF484C7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $112,00 $65,80
Product Family MAX 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Gehäuse 484-ball FineLine BGA (F484) 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 2
Global Clock Networks 20 [DATA_NEEDED: global clocks count]
Speed Grade 7 (slowest industrial bin, highest margin) —
Betriebstemperatur -40C to +100C (Tj, industrial) 0 C to +85 C (commercial grade, C7 speed)
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS-Status Compliant Compliant
Product Type — FPGA (Field-Programmable Gate Array)
Series — MAX 10
Logic Elements — 50,000
Embedded Memory — 1,677,312 bits (approximately 1.6 Mbit)
Embedded 18x18 Multipliers — 312
User Flash Memory — [DATA_NEEDED: user flash bits]
Number of User I/O — 360
Versorgungsspannung — 1.2 V core (VCCINT)
Montageart — Surface Mount
Configuration Memory — Non-volatile embedded flash (dual-configuration)
ADC — Integrated 12-bit SAR, up to 17 channels
Process Technology — 55 nm embedded flash CMOS
MSL-Level — 3

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