10M50DAF484I7P vs 10M50DAF484I7G Comparison

Detailed side-by-side comparison of 10M50DAF484I7P by Intel and 10M50DAF484I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DAF484I7P 10M50DAF484I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $112.00 $58.20
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 1,677,312
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Package 484-ball FineLine BGA (F484) 484-ball FBGA (F484)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) Yes (dual-boot)
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 4
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Operating Temperature -40C to +100C (Tj, industrial) —
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS Status Compliant Compliant
Family — MAX 10
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Process Technology — TSMC 55 nm
Supply Voltage - Core — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
Integrated ADC — 12-bit, 1 MSPS, up to 18 channels
DSP Blocks — 144 (18x18 multipliers)
Configuration Mode — Single-chip (no external boot device required)
Mounting Type — Surface Mount (FBGA)
MSL Level — 3 (per JEDEC J-STD-020)
Lead-free / Halogen-free — Yes / Yes

Datasheets & Resources

Browse All Products Create BOM Request Quote