10M50DAF484I7P vs 10M50DAF484I7G Comparación
Comparación detallada lado a lado de 10M50DAF484I7P por Intel y 10M50DAF484I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M50DAF484I7P | 10M50DAF484I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,00 | $58,20 |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Encapsulado | 484-ball FineLine BGA (F484) | 484-ball FBGA (F484) |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | Yes (dual-boot) |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 4 |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | — |
| Temperatura de funcionamiento | -40C to +100C (Tj, industrial) | — |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Process Technology | — | TSMC 55 nm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Integrated ADC | — | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Configuration Mode | — | Single-chip (no external boot device required) |
| Tipo de montaje | — | Surface Mount (FBGA) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |