10M50DAF484I7P vs 10M50DAF484I7G Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7P von Intel und 10M50DAF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7P 10M50DAF484I7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $112,00 $58,20
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 1,677,312
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Gehäuse 484-ball FineLine BGA (F484) 484-ball FBGA (F484)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) Yes (dual-boot)
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 4
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Betriebstemperatur -40C to +100C (Tj, industrial) —
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS-Status Compliant Compliant
Family — MAX 10
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Process Technology — TSMC 55 nm
Supply Voltage - Core — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
Integrated ADC — 12-bit, 1 MSPS, up to 18 channels
DSP Blocks — 144 (18x18 multipliers)
Configuration Mode — Single-chip (no external boot device required)
Montageart — Surface Mount (FBGA)
MSL-Level — 3 (per JEDEC J-STD-020)
Lead-free / Halogen-free — Yes / Yes

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