10M50DAF484I7P vs 10M50DCF484I7G Comparison

Detailed side-by-side comparison of 10M50DAF484I7P by Intel and 10M50DCF484I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DAF484I7P 10M50DCF484I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $112.00 $99.60
Product Family MAX 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Package 484-ball FineLine BGA (F484) 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 4
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) 7 (fastest commercial/industrial)
Operating Temperature -40C to +100C (Tj, industrial) —
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS Status Compliant Compliant
Family — MAX 10
Logic Elements — 50,000
Embedded SRAM — 1,677,312 bits (1.6 Mb)
User Flash Memory — Up to 5,888 Kb (on-chip dual configuration)
Maximum User I/O Pins — 360
LVDS Channels (dedicated) — 160 (rx + tx)
18x18 Hardware Multipliers — 144
Core Voltage — 1.2 V (internal)
Process Technology — TSMC 55 nm embedded flash
Operating Junction Temperature — -40C to +100C (industrial, 'I' suffix)
Configuration Mode — On-chip flash + JTAG
Integrated ADC — 12-bit, up to 17 channels, 1 MSPS
Mounting Type — Surface Mount (BGA)

Datasheets & Resources

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