10M50DAF484I7P vs 10M50DCF484I7G Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7P von Intel und 10M50DCF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7P 10M50DCF484I7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $112,00 $99,60
Product Family MAX 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Gehäuse 484-ball FineLine BGA (F484) 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 4
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) 7 (fastest commercial/industrial)
Betriebstemperatur -40C to +100C (Tj, industrial) —
Configuration Modes Internal flash, JTAG, dual-boot image support —
RoHS-Status Compliant Compliant
Family — MAX 10
Logic Elements — 50,000
Embedded SRAM — 1,677,312 bits (1.6 Mb)
User Flash Memory — Up to 5,888 Kb (on-chip dual configuration)
Maximum User I/O Pins — 360
LVDS Channels (dedicated) — 160 (rx + tx)
18x18 Hardware Multipliers — 144
Core Voltage — 1.2 V (internal)
Process Technology — TSMC 55 nm embedded flash
Betriebs-Sperrschichttemperatur — -40C to +100C (industrial, 'I' suffix)
Configuration Mode — On-chip flash + JTAG
Integrated ADC — 12-bit, up to 17 channels, 1 MSPS
Montageart — Surface Mount (BGA)

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