10M50DCF256A7G vs 10M50DAF256I7G Comparison

Detailed side-by-side comparison of 10M50DCF256A7G by Intel and 10M50DAF256I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DCF256A7G 10M50DAF256I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $29.80 $155.20
Family MAX 10 MAX 10
Logic Elements (LE) 50,000 50,000
User Flash Memory 1,677,312 bits —
User I/O Count 178 —
Package 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch 256-LBGA (17 mm x 17 mm)
Process Node 55 nm —
Core Voltage 1.2 V 1.2 V
I/O Bank Voltages 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Operating Temperature -40 C to +85 C (industrial) -40C to +100C (Industrial)
Speed Grade 7 (DCF = dual-supply, commercial/industrial) —
Embedded Memory M9K blocks, 9 Kbits each —
Embedded Multipliers 144 x 18 x 18 —
PLL 4 —
On-chip ADC 12-bit, 1 MSPS, 16 channels —
Configuration Internal flash (single-chip, instant-on) —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
MSL Level 3 (168 hours) —
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (M9K bits) — 1,677,312
DSP Blocks (18 x 18 multipliers) — 4
Maximum User I/O — 178
Configuration Memory — Internal non-volatile flash (dual-boot)
Integrated ADC — 12-bit SAR, up to 17 analog inputs
PLLs — On-chip (4 typical for 10M50 family)
Process Technology — TSMC 55 nm embedded flash
Tray Quantity — 90 per tray (typical for 256-BGA)
Configuration Mode — Internal flash (instant-on)

Datasheets & Resources

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