5CGXBC9D6F27C7N vs 5CGXBC9D7F27C8N Comparison
Detailed side-by-side comparison of 5CGXBC9D6F27C7N by Intel and 5CGXBC9D7F27C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 5CGXBC9D6F27C7N | 5CGXBC9D7F27C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $289.00 | $370.00 |
| Family | Cyclone V GX | — |
| Logic Elements | 301,000 | 113,560 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits (6,876 Kbit M10K + 657 Kbit MLAB) |
| Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| Embedded Multipliers (18x18) | 336 | — |
| Transceivers | GX family transceivers (per package variant) | 9 channels, up to 3.125 Gbps |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PCIe Hard IP | Yes, Gen1/Gen2 | — |
| Core Voltage | 1.1 V | — |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for FBGA-672] | 336 |
| Process Technology | 28 nm TSMC low-power | — |
| Package | 672-ball FBGA | 672-ball FineLine BGA (F27), 27 mm x 27 mm |
| Speed/Grade | C7 (commercial, speed grade 7) | — |
| Mounting Type | Surface Mount (BGA) | — |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | Compliant | Compliant |
| Series | — | Cyclone V GX |
| Embedded Multipliers | — | 156 (18x18) |
| Number of I/O Banks | — | 9 |
| Number of PLLs | — | 4 |
| Hard PCIe Gen2 | — | x4 IP block |
| Speed Grade | — | -8 |
| Operating Temperature | — | -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Configuration Modes | — | JTAG, AS, PS, FPP |