5CGXBC9D7F27C8N - Cyclone V GX FPGA, 113K LE, 672-BGA | Intel
MPN: 5CGXBC9D7F27C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $497.23708 | $497.24 |
| 10 | $460 | $4,600.00 |
| 100 | $425 | $42,500.00 |
| 250 | $395 | $98,750.00 |
| 500 | $370 | $185,000.00 |
Drop-in alternatives for 5CGXBC9D7F27C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CGXBC9D6F27C7N
✅ Drop-In✓ In Stock
$289 / Unit
View Datasheet →5CGXBC9C7F23C8N
✅ Drop-In✓ In Stock
$54.8 / Unit
View Datasheet →5CGXBC9A7U19C8N
✅ Drop-In✓ In Stock
$219.75 / Unit
View Datasheet →5CEFA9F27C7N
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →5CEFA9F23I7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →5CGXBC9D7F27C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V GX |
| Logic Elements | 113,560 |
| Embedded Memory | 14,251,008 bits (6,876 Kbit M10K + 657 Kbit MLAB) |
| Embedded Multipliers | 156 (18x18) |
| User I/O Pins | 336 |
| Number of I/O Banks | 9 |
| Number of PLLs | 4 |
| Transceivers | 9 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 | x4 IP block |
| Package | 672-ball FineLine BGA (F27), 27 mm x 27 mm |
| Speed Grade | -8 |
| Operating Temperature | -40C to +100C (industrial) |
| Process Node | TSMC 28 nm low-power |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
5CGXBC9D7F27C8N 672-ball fineline bga (f27), 27 mm x 27 mm Pin Configuration Guide
Complete pinout information for 5CGXBC9D7F27C8N (672-ball fineline bga (f27), 27 mm x 27 mm package) with 336 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC9D7F27C8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 336 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC9D7F27C8N is suitable for 6 applications: Industrial Machine Vision Cameras, Broadcast Video Processing (SDI to HDMI bridging), PCIe-based Data Acquisition Cards, Motor Drives and Encoder Interfaces, Industrial Ethernet Gateways (EtherCAT, PROFINET), Handheld Medical Imaging (Ultrasound, Endoscopy).
Industrial Machine Vision Cameras
The 5CGXBC9D7F27C8N fits industrial machine vision cameras because its 113,560 logic elements and 156 18x18 multipliers deliver real-time Bayer-to-RGB conversion, image rectification, and edge detection at >60 fps for full-HD sensor streams. The 14.25 Mbit embedded memory (6,876 Kbit M10K + 657 Kbit MLAB) buffers several uncompressed frames, while the 336 user I/Os connect directly to MIPI-CSI, LVDS, and sub-LVDS image sensors without bridge chips. Industrial temperature grade (-40C to +100C) ensures operation on factory floors without thermal derating. Recommended companion parts: TIDA-00254 reference image sensor boards.
Recommended
Broadcast Video Processing (SDI to HDMI bridging)
The 5CGXBC9D7F27C8N's 9 integrated 3.125 Gbps transceivers handle 3G-SDI input/output for broadcast-grade video capture, while 113K logic elements implement color-space conversion, scaling, and de-interlacing pipelines. Hardened PCIe Gen2 x4 IP block enables direct connection to host video capture cards, eliminating external bridge chips. The 672-BGA package provides sufficient I/O for HDMI 2.0, HD-SDI, and 12G-SDI AUX interfaces alongside embedded audio. Industrial temperature grade supports broadcast-equipment rack environments with elevated intake temperatures.
Recommended
PCIe-based Data Acquisition Cards
The 5CGXBC9D7F27C8N's hardened PCIe Gen2 x4 IP block delivers 5 Gbps per lane without consuming logic elements, freeing 113K LE for DSP, FIR filters, and FFT blocks for high-channel-count data acquisition. The 9 transceivers also support front-panel SFP+ connectivity for industrial Ethernet, Aurora, or 10GbE backhaul, while the 336 user I/Os interface to ADC/DAC clusters. Industrial temperature grade ensures reliable operation in chassis that house multiple DAQ cards with shared airflow.
Recommended
Motor Drives and Encoder Interfaces
The 5CGXBC9D7F27C8N is well-suited for multi-axis industrial motor drives because 336 I/Os accept incremental encoder inputs (QEP), Hall sensors, and PWM outputs for up to 6 axes, while 156 18x18 multipliers implement Park/Clarke transforms and SVPWM modulators in real time. Industrial temperature grade (-40C to +100C) handles cabinet temperatures near inverters. The hardened PCIe Gen2 IP also enables connection to motion controllers over PCIe. 14.25 Mbit of embedded memory supports trajectory buffers and parameter sets.
Recommended
Industrial Ethernet Gateways (EtherCAT, PROFINET)
The 5CGXBC9D7F27C8N implements EtherCAT, PROFINET IRT, or SERCOS III slave stacks using 113K logic elements and the 9 transceivers (3.125 Gbps) for MII/RGMII-to-fiber bridging. Industrial temperature grade supports operation in IP67 cabinets found on factory floors. The PCIe Gen2 x4 IP block enables direct host attachment for high-speed industrial PCs, while 336 I/Os provide GPIO for digital I/O islands. The 5CGXBC9D7F27C8N's hardened MACs and time-stamping logic cut soft-logic footprint by 30% versus pure soft implementations.
Recommended
Handheld Medical Imaging (Ultrasound, Endoscopy)
The 5CGXBC9D7F27C8N's low-power 28 nm process and 113K logic elements enable compact handheld medical imaging with battery operation. Its 156 18x18 multipliers perform real-time beamforming and FFT for portable ultrasound, while the 14.25 Mbit embedded memory buffers raw RF samples before processing. The 9 transceivers support 3.125 Gbps LVDS links to analog front ends, and the hardened PCIe Gen2 x4 IP allows docking-station connection for high-resolution display output. Industrial temperature grade supports operation across clinical and field environments.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC9D7F27C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC9D6F27C7N | 5CGXBC9C7F23C8N | 5CGXBC9A7U19C8N | 5CEFA9F27C7N | 5CEFA9F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (F27) | 672-BGA (F27) - same | 672-BGA (F27) - same | 672-BGA (F27) - same | 672-BGA (F27) - same | 672-BGA (F27) - same |
| Logic Elements | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Transceivers | 9 x 3.125 Gbps | 9 x 3.125 Gbps | 9 x 3.125 Gbps | 9 x 3.125 Gbps | None (E variant) | None (E variant) |
| Hard PCIe Gen2 | x4 IP block | x4 IP block | x4 IP block | x4 IP block | None (E variant) | None (E variant) |
| Speed Grade | -8 | -7 | -8 | -8 | -7 | -7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial | Industrial | Commercial | Industrial |
| User I/O Pins | 336 | 336 | 336 | 336 | 336 | 336 |
Key Differentiators
- Industrial temperature grade at -8 speed grade (vs 5CGXBC9D6F27C7N)
- Retains 9 transceivers and hard PCIe Gen2 IP (vs 5CEFA9F27C7N)
- Same F27 672-BGA footprint across speed/temperature variants (vs 5CGXBC9D6F27C7N)
Design Notes
The 672-ball FineLine BGA package (27 mm x 27 mm, 1.0 mm ball pitch) requires at least 6 PCB layers with a continuous ground plane directly below the BGA. Use microvia or via-in-pad technology for clean fan-out; dog-bone fan-out works but traces may need length matching for high-speed I/O. Maintain 50 ohm single-ended controlled impedance on all 3.125 Gbps transceiver traces, and 85 ohm differential for PCIe lanes. Reference Cyclone V GX Device Handbook (CVG-52001) pin connection guidelines for unused-pin termination.
Estimated: at 100% logic utilization with 9 transceivers active, the 5CGXBC9D7F27C8N draws approximately 1.2-2.5 W from VCCINT and VCCAUX rails (based on Cyclone V GX power-supply design guide). Plan decoupling with 100 nF X7R per power pin plus 10 uF bulk caps per rail. The transceiver PLLs require dedicated filtering on VCCR_TXB and VCCA_TXB rails. Decoupling must be placed on the same layer (top or bottom) as the BGA escape - never route power through vias without local capacitance.
Maintain length matching within 50 mils for PCIe transmit pairs and within 150 mils for 3G-SDI/3.125 Gbps transceiver pairs. Use a differential intra-pair skew target of 5 mils (12 ps at 1 mm/ns propagation). For LVDS interfaces (sub-LVDS, SLVS), place a 100 ohm differential termination resistor at the receiver end. Avoid routing transceivers across plane splits; route all high-speed serial links over a continuous reference plane.
Do not leave transceiver channels floating when unused - per the Cyclone V GX Device Handbook, unused TX pins should be tied through proper resistor networks or the transceiver channel disabled in Quartus Prime to avoid excessive current draw. Also, the configuration mode pins (MSEL) must be set correctly for the selected boot mode (AS, PS, FPP, JTAG) or the device will not configure. Finally, ensure the JTAG chain TCK/TMS/TDO/TDI signals have 4.7 kohm pull-ups per the JTAG specification.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified (industrial grade only). Lead-free reflow profile per JEDEC J-STD-020.
