5CGXBC9D6F27C7N vs 5CGXBC9D7F27C8N 비교
다음의 상세 나란히 비교: 5CGXBC9D6F27C7N 제조: Intel 및 5CGXBC9D7F27C8N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 5CGXBC9D6F27C7N | 5CGXBC9D7F27C8N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $289.00 | $370.00 |
| Family | Cyclone V GX | — |
| Logic Elements | 301,000 | 113,560 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits (6,876 Kbit M10K + 657 Kbit MLAB) |
| Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| Embedded Multipliers (18x18) | 336 | — |
| Transceivers | GX family transceivers (per package variant) | 9 channels, up to 3.125 Gbps |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PCIe Hard IP | Yes, Gen1/Gen2 | — |
| Core Voltage | 1.1 V | — |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for FBGA-672] | 336 |
| Process Technology | 28 nm TSMC low-power | — |
| 패키지 | 672-ball FBGA | 672-ball FineLine BGA (F27), 27 mm x 27 mm |
| Speed/Grade | C7 (commercial, speed grade 7) | — |
| 실장 유형 | Surface Mount (BGA) | — |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | — |
| RoHS 상태 | Compliant | Compliant |
| Series | — | Cyclone V GX |
| Embedded Multipliers | — | 156 (18x18) |
| Number of I/O Banks | — | 9 |
| Number of PLLs | — | 4 |
| Hard PCIe Gen2 | — | x4 IP block |
| Speed Grade | — | -8 |
| 동작 온도 | — | -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Configuration Modes | — | JTAG, AS, PS, FPP |