5CSEBA4U23C7SN vs 5CSEBA4U23C6N Comparison

Detailed side-by-side comparison of 5CSEBA4U23C7SN by Intel and 5CSEBA4U23C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA4U23C7SN 5CSEBA4U23C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $18.20 $86.20
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Device Logic Elements 40,000 —
Hard Processor System Dual-core ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 800 MHz —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] [DATA_NEEDED: ALM count]
Embedded Memory (Kbits) 2,460 —
DSP Blocks (18x18) 112 —
Maximum User I/Os 364 —
Package 672-ball UBGA, 23x23 mm 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch
Ball Pitch 0.8 mm —
Process Node TSMC 28 nm low-power —
Operating Temperature -40C to +85C (industrial) —
Memory Interfaces DDR2, DDR3, LPDDR2 (hard controller) —
Peripherals (HPS) USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART —
Configuration Modes JTAG, serial passive/active JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ
Speed Grade C7 —
RoHS Status Compliant Compliant
Logic Elements — 40,000
Embedded Memory (M10K + MLAB) — 2,460 Kbits
DSP Blocks (18x18 Multipliers) — 112
HPS Processor Cores — Dual ARM Cortex-A9 MPCore
HPS Maximum CPU Clock — 925 MHz
Hard Memory Controller — DDR3 / DDR3L / LPDDR2
Process Technology — TSMC 28 nm low-power
Core Voltage (VCC) — 1.1 V
General-Purpose FPGA I/Os — 188
Transceivers — Not integrated on SE device
Mounting Type — Surface Mount (BGA)
Operating Junction Temperature — -40 C to +100 C (typical SE spec; exact C6 grade per datasheet)

Datasheets & Resources

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