5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA4U23C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $138.33 | $138.33 |
| 10 | $128.5 | $1,285.00 |
| 100 | $112.75 | $11,275.00 |
| 500 | $98.4 | $49,200.00 |
| 1,000 | $86.2 | $86,200.00 |
Drop-in alternatives for 5CSEBA4U23C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA6U23C6N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA5U23C6N
✅ Drop-In✓ In Stock
$122.33 / Unit
View Datasheet →5CSEBA2U23C6N
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$198.75 / Unit
View Datasheet →5CSEBA4U23A7N
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$185 / Unit
View Datasheet →5CSEBA4U23C7N
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$124.5 / Unit
View Datasheet →5CSEBA4U23C8N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSEBA4U23C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 |
| Embedded Memory (M10K + MLAB) | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | 112 |
| HPS Processor Cores | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | 925 MHz |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR2 |
| Process Technology | TSMC 28 nm low-power |
| Core Voltage (VCC) | 1.1 V |
| General-Purpose FPGA I/Os | 188 |
| Transceivers | Not integrated on SE device |
| Package | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Junction Temperature | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |
| Configuration Modes | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |
| RoHS Status | Compliant |
5CSEBA4U23C6N 672-pin ufbga / ubga, 23 x 23 mm, 0.8 mm pitch Pin Configuration Guide
Complete pinout information for 5CSEBA4U23C6N (672-pin ufbga / ubga, 23 x 23 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U23C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U23C6N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Industrial IoT Gateway and Protocol Bridge, Medical Imaging Pre-Processing, Defense and SDR Front-End, Automotive Infotainment Prototyping.
Industrial Machine Vision
The 5CSEBA4U23C6N is well matched to industrial machine vision because the FPGA fabric delivers 224 18x18 multipliers and 2,460 Kbits of embedded memory, enabling real-time Bayer demosaicing, Sobel/edge detection, and CNN inference acceleration. The dual ARM Cortex-A9 cores at 925 MHz run the GigE Vision, USB3 Vision, or GenICam host stack and TCP/IP networking. With 188 general-purpose I/Os, the 672-ball UFBGA exposes parallel CMOS camera interfaces, machine-light strobe triggers, and LVDS lines for area-scan cameras. Compared to a discrete CPU+FPGA board, the integrated HPS reduces board area, BOM, and PCIe/cable latency between processors, which matters for high-frame-rate sorting and inspection lines.
Recommended
Motor Control and Industrial Drives
The 5CSEBA4U23C6N is ideal for multi-axis motor drives and servo controllers because the FPGA fabric implements deterministic PWM, encoder (EnDat, BISS, SSI) interfaces, and field-oriented control loops with sub-microsecond latency, while the dual Cortex-A9 at 925 MHz runs EtherCAT, PROFINET, or CANopen master stacks. The 672-ball UFBGA provides enough LVDS pairs and 3.3 V tolerant I/O for resolver-to-digital converters, gate-driver fault inputs, and brake control. The 28 nm low-power process keeps junction temperature manageable in sealed IP65 enclosures. Designers migrating from separate DSP+MCU boards benefit from collapsing two ICs and a bus bridge into a single SoC FPGA, cutting PCB area by roughly 40%.
Recommended
Industrial IoT Gateway and Protocol Bridge
The 5CSEBA4U23C6N fits IIoT gateways because the dual Cortex-A9 HPS runs Linux with TCP/IP, MQTT, and OPC-UA stacks while the FPGA fabric terminates legacy fieldbuses (Modbus RTU, PROFIBUS, DeviceNet, RS-485) that cannot be handled by the host CPU alone. The HPS gigabit Ethernet MAC, USB 2.0, and CAN interfaces give multi-protocol connectivity, and the 40K logic elements are sufficient for deterministic protocol decode, CRC, and timestamping. With 188 I/Os, the 672-ball UFBGA connects directly to RS-485 transceivers, opto-isolated digital inputs, and 4-20 mA analog front-ends. Compared to a CPU-only gateway, adding the FPGA fabric offloads the CPU from hard real-time polling, eliminating jitter on critical control loops.
Recommended
Medical Imaging Pre-Processing
The 5CSEBA4U23C6N suits medical imaging preprocessing such as ultrasound beamforming, endoscopy pixel pipelines, and patient-monitoring DSP front ends. The FPGA fabric's 224 18x18 multipliers accelerate FIR filters, Hilbert transforms, and envelope detection at line rate, while the dual Cortex-A9 runs the higher-level user interface, network protocols (DICOM, HL7), and storage stack. The HPS DDR3 controller hosts large frame buffers for raw ultrasound or video streams, and the 1.1 V core plus 28 nm process keeps dissipation low enough for portable cart-mounted equipment. Designers benefit from a single-CPU+FPGA solution that simplifies IEC 62304 software classification and reduces the supplier count for FDA documentation.
Recommended
Defense and SDR Front-End
The 5CSEBA4U23C6N is a practical base for software-defined radio front ends where the FPGA side implements DDC/DUC, channelizers, and cryptography, while the dual ARM Cortex-A9 cores run the waveform, link-layer protocol, and network stack. The 672-ball UFBGA exposes enough LVDS pairs to interface with high-speed ADCs and DACs in direct-conversion radios, and the HPS gigabit Ethernet MAC delivers digitized IF to a host processor or network. Compared to ASIC-based radios, the Cyclone V SE allows mid-program reprogramming for new waveforms without respinning silicon. The SE device omits transceivers, so designers add an external RF front-end or pair the SoC with a Cyclone V GT/SX device if high-speed serial links are required.
Recommended
Automotive Infotainment Prototyping
The 5CSEBA4U23C6N supports automotive infotainment prototyping where the HPS runs Linux/Android Automotive, MOST or Ethernet AVB audio-video bridging, and the FPGA fabric accelerates display composition, video scaling, and MIPI CSI-2 virtual-channel demuxing. The 188 FPGA I/Os handle LVDS display panels, touch controllers, and rear-camera inputs simultaneously, while the HPS USB 2.0, SD/MMC, and CAN interfaces link to the rest of the vehicle network. Compared to discrete CPU+FPGA prototypes, integrating the HPS into the same package simplifies PCB routing for high-speed display buses and reduces BOM cost. For production automotive programs, designers migrate to the Q100-qualified Cyclone V SE -A7N part.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U23C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U23C6N | 5CSEBA5U23C6N | 5CSEBA2U23C6N | 5CSEBA4U23A7N | 5CSEBA4U23C8N |
|---|---|---|---|---|---|---|
| Package | 672-pin UFBGA (U23, 23x23 mm, 0.8 mm pitch) | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 40,000 | 110,000 | 85,000 | 25,000 | 40,000 | 40,000 |
| HPS CPU Cores | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz |
| Embedded Memory | 2,460 Kbits | 5,570 Kbits | 3,970 Kbits | 1,660 Kbits | 2,460 Kbits | 2,460 Kbits |
| DSP 18x18 Multipliers | 112 (224 18x18 multipliers) | 224 (448 18x18 multipliers) | 156 (312 18x18 multipliers) | 80 (160 18x18 multipliers) | 112 (224 18x18 multipliers) | 112 (224 18x18 multipliers) |
| Speed Grade | C6 (industrial) | C6 | C6 | C6 | A7 | C8 |
| Process Node | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Approx Unit Price @ 1k | 86.20 USD | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest density option in the U23 BGA family with the same HPS block (vs 5CSEBA2U23C6N)
- Mid-range cost-density sweet spot vs higher-density variants (vs 5CSEBA6U23C6N)
- Pin-compatible migration path with speed-grade variants (vs 5CSEBA4U23C8N)
Design Notes
Estimated: the 672-pin UFBGA at 0.8 mm pitch requires at least a 4-layer PCB with a continuous ground plane directly under the package to control return paths for the HPS DDR3 byte lanes. Use microvia-in-pad construction (or 0.4 mm laser vias with tented pads) for the inner-row balls to escape BGA fan-out. Length-match HPS DDR3 byte lanes within +/- 25 mil and route each byte group on a single inner layer with reference to a continuous ground plane; this preserves signal integrity for DDR3-1600 operation.
Estimated: each of VCC_HPS, VCC_IO (per bank), VCC_PLL, and VCC_FPGA must have a dedicated 0.1 uF X7R decoupling capacitor within 2 mm of its supply ball, plus a 10 uF bulk capacitor per supply domain within 25 mm. The 1.1 V VCC rail typically draws 1-3 A at full HPS+FPGA utilization; size the regulator for at least 5 A headroom and place it within 50 mm of the UFBGA. A dedicated ferrite bead on the analog VCC_PLL rail improves HPS jitter margin.
Estimated: at 25 C ambient and 5 W dissipation in the 672-ball UFBGA with a 4-layer PCB and no heatsink, junction temperature rises roughly 25 C above ambient (theta_JA near 5 C/W). For sealed industrial enclosures with 65 C ambient, attach a 10x10 mm copper pad or a small 15 C/W heatsink to keep Tj below the 100 C industrial limit. Use Quartus Prime PowerPlay to obtain an accurate dissipation number before finalizing the thermal design.
Configure the 5CSEBA4U23C6N via Active Serial (AS) mode using an EPCQ256 or compatible 256-Mbit QSPI flash for production; JTAG mode is intended for development only. Hold nCONFIG low during power-up and ensure MSEL[2:0] are strapped to the AS mode (typically 000) before releasing nSTATUS. The HPS boots from the same flash using the dedicated SDM pins; verify pin-mux settings in Quartus Prime's HPS Platform Designer to avoid contention with FPGA I/O banks.
Compliance Information
RoHS compliance per Intel Cyclone V SE product family documentation. Not AEC-Q100 qualified - choose automotive-grade SoC FPGA parts for vehicle programs. Halogen-free status not specified in verified web data.
