5CSEBA4U23C8N vs 5CSEBA4U23C7SN Comparison

Detailed side-by-side comparison of 5CSEBA4U23C8N by Intel and 5CSEBA4U23C7SN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA4U23C8N 5CSEBA4U23C7SN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $138.20 $18.20
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements (LE) 40,000 —
Processor Core Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum HPS Frequency 600 MHz —
Embedded Memory [DATA_NEEDED: total Kbits] —
DSP Blocks [DATA_NEEDED: variable-precision DSP count] —
Multipliers 18x18 dedicated multipliers —
Maximum User I/O 188 —
Package 672-pin UBGA (UBGA-672, 23x23 mm) 672-ball UBGA, 23x23 mm
Process Technology TSMC 28 nm low-power —
HPS Peripherals Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC —
Memory Controller (HPS) DDR3/DDR3L/LPDDR2 with hard PHY —
Operating Temperature [DATA_NEEDED: industrial Tj range] -40C to +85C (industrial)
Mounting Type Surface Mount (BGA) —
RoHS Status Compliant Compliant
Lead-Free Yes —
Device Logic Elements — 40,000
Hard Processor System — Dual-core ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency — 800 MHz
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory (Kbits) — 2,460
DSP Blocks (18x18) — 112
Maximum User I/Os — 364
Ball Pitch — 0.8 mm
Process Node — TSMC 28 nm low-power
Memory Interfaces — DDR2, DDR3, LPDDR2 (hard controller)
Peripherals (HPS) — USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART
Configuration Modes — JTAG, serial passive/active
Speed Grade — C7

Datasheets & Resources

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