5CSEBA4U23C8N vs 5CSEBA4U23C7SN Comparaison
Comparaison détaillée côte à côte de 5CSEBA4U23C8N par Intel et 5CSEBA4U23C7SN par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ ActifIntel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ ActifComparaison des spécifications
| Paramètre | 5CSEBA4U23C8N | 5CSEBA4U23C7SN |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $138,20 | $18,20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 | — |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum HPS Frequency | 600 MHz | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP count] | — |
| Multipliers | 18x18 dedicated multipliers | — |
| Maximum User I/O | 188 | — |
| Boîtier | 672-pin UBGA (UBGA-672, 23x23 mm) | 672-ball UBGA, 23x23 mm |
| Process Technology | TSMC 28 nm low-power | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC | — |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY | — |
| Température de fonctionnement | [DATA_NEEDED: industrial Tj range] | -40C to +85C (industrial) |
| Type de montage | Surface Mount (BGA) | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 40,000 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 800 MHz |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Kbits) | — | 2,460 |
| DSP Blocks (18x18) | — | 112 |
| Maximum User I/Os | — | 364 |
| Ball Pitch | — | 0.8 mm |
| Process Node | — | TSMC 28 nm low-power |
| Memory Interfaces | — | DDR2, DDR3, LPDDR2 (hard controller) |
| Peripherals (HPS) | — | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART |
| Configuration Modes | — | JTAG, serial passive/active |
| Speed Grade | — | C7 |