5M570ZF256C5N vs 5M570ZF256C4N Comparison

Detailed side-by-side comparison of 5M570ZF256C5N by Intel and 5M570ZF256C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5M570ZF256C5N 5M570ZF256C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $13.20 $6.42
Family MAX V MAX V
Logic Elements (LE) 570 —
Macro Cells 440 —
Maximum User I/Os 159 —
Number of Pins 256 —
Package Type FBGA-256 (FineLine BGA) —
Supply Voltage 1.8 V core (3.3 V I/O supported via internal LDO) —
Operating Frequency (fMAX) 118.3 MHz —
Propagation Delay (tPD) 8.5 ns (commercial speed grade 5) —
User Flash Memory 8 Kbit 8192 bits (8 Kbit)
Configuration Memory On-chip non-volatile flash —
Programming Interface JTAG (IEEE 1149.1) / ISP JTAG (IEEE 1149.1) / In-System Programmable
Operating Temperature Range 0C to +85C (commercial) —
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level 3 (per JEDEC J-STD-020) —
RoHS Status Compliant Compliant
Lead-Free Yes —
Device Logic Elements — 570
Number of Macrocells — 440
Number of Logic Array Blocks (LABs) — 57
Number of Programmable I/Os — 159
Maximum Operating Frequency — 152 MHz
Pin-to-Pin Logic Delay (tPD) — 9.5 ns
Core Supply Voltage (VCCINT) — 1.71 V to 1.89 V (nominal 1.8 V)
I/O Bank Supply (VCCIO) — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
Operating Temperature — 0 °C to +85 °C (Commercial, C4)
Package — FBGA-256 (17 mm × 17 mm, 1.0 mm pitch)

Datasheets & Resources

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