A3P400-2FGG144 vs A3P600-2FGG144 Comparison

Detailed side-by-side comparison of A3P400-2FGG144 by Microchip Technology and A3P600-2FGG144 by Microsemi. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3P400-2FGG144 A3P400-2FGG144 - ProASIC3 Flash FPGA 97 I/O | Microchip

A3P400-2FGG144 - ProASIC3 Flash FPGA 97 I/O | Microchip

A3P400-2FGG144 ✓ Active

Specification Comparison

Parameter A3P400-2FGG144 A3P600-2FGG144
Brand Microchip Technology Microsemi
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $40.20 $30.40
Family ProASIC3 ProASIC3
System Gates 403000 —
User I/Os 97 —
Embedded SRAM 55296 bits (true dual-port) —
Package 144-LBGA (FGG144) 144-Ball FBGA (FGG144)
Programming Technology Nonvolatile Flash —
Process Technology 130 nm, 7-layer metal (6 copper) CMOS 130 nm CMOS
Live at Power-Up LAPU Level 0 —
Configuration Single-chip, no external boot ROM Single-chip, Instant On, no external boot device
Soft Processor Support Optional soft ARM support —
I/O Banks 4 (independent VCCIBx supplies) 4 (independently supplied VCCIB banks)
Reprogrammability Yes (in-system reprogrammable flash) —
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Supply Voltage [DATA_NEEDED: core supply voltage] —
RoHS Status Lead free (per Kynix listing) [DATA_NEEDED: RoHS status]
Speed Grade -2 -2
Equivalent Gate Count — 600000 gates
Logic Cells (CLBs) — 13824 CLBs
User I/O — 97 I/O
System Performance — 310 MHz
Core Voltage — 1.5 V
Program Technology — Nonvolatile Flash
Ball Pitch — 1 mm
Packaging — Tray
Embedded Memory — [DATA_NEEDED: embedded RAM bits]

Datasheets & Resources

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