A3P400-2FGG144 vs A3P600-2FGG144 Vergleich
Detaillierter Direktvergleich von A3P400-2FGG144 von Microchip Technology und A3P600-2FGG144 von Microsemi. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | A3P400-2FGG144 | A3P600-2FGG144 |
|---|---|---|
| Marke | Microchip Technology | Microsemi |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $40,20 | $30,40 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 403000 | — |
| User I/Os | 97 | — |
| Embedded SRAM | 55296 bits (true dual-port) | — |
| Gehäuse | 144-LBGA (FGG144) | 144-Ball FBGA (FGG144) |
| Programming Technology | Nonvolatile Flash | — |
| Process Technology | 130 nm, 7-layer metal (6 copper) CMOS | 130 nm CMOS |
| Live at Power-Up | LAPU Level 0 | — |
| Configuration | Single-chip, no external boot ROM | Single-chip, Instant On, no external boot device |
| Soft Processor Support | Optional soft ARM support | — |
| I/O Banks | 4 (independent VCCIBx supplies) | 4 (independently supplied VCCIB banks) |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Versorgungsspannung | [DATA_NEEDED: core supply voltage] | — |
| RoHS-Status | Lead free (per Kynix listing) | [DATA_NEEDED: RoHS status] |
| Speed Grade | -2 | -2 |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |