A3P400-2FGG144 vs A3P600-2FGG144 Comparaison
Comparaison détaillée côte à côte de A3P400-2FGG144 par Microchip Technology et A3P600-2FGG144 par Microsemi. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | A3P400-2FGG144 | A3P600-2FGG144 |
|---|---|---|
| Marque | Microchip Technology | Microsemi |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $40,20 | $30,40 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 403000 | — |
| User I/Os | 97 | — |
| Embedded SRAM | 55296 bits (true dual-port) | — |
| Boîtier | 144-LBGA (FGG144) | 144-Ball FBGA (FGG144) |
| Programming Technology | Nonvolatile Flash | — |
| Process Technology | 130 nm, 7-layer metal (6 copper) CMOS | 130 nm CMOS |
| Live at Power-Up | LAPU Level 0 | — |
| Configuration | Single-chip, no external boot ROM | Single-chip, Instant On, no external boot device |
| Soft Processor Support | Optional soft ARM support | — |
| I/O Banks | 4 (independent VCCIBx supplies) | 4 (independently supplied VCCIB banks) |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Tension d'alimentation | [DATA_NEEDED: core supply voltage] | — |
| Statut RoHS | Lead free (per Kynix listing) | [DATA_NEEDED: RoHS status] |
| Speed Grade | -2 | -2 |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |