A3P400-2FGG144 - ProASIC3 Flash FPGA 97 I/O | Microchip
MPN: A3P400-2FGG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $47.59 | $47.59 |
| 10 | $46.42 | $464.20 |
| 100 | $44.1 | $4,410.00 |
| 500 | $42.15 | $21,075.00 |
| 1,000 | $40.2 | $40,200.00 |
Drop-in alternatives for A3P400-2FGG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-2FGG144
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View Datasheet →A3P250-2FGG144
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View Datasheet →A3P1000-2FGG144
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View Datasheet →A3P600-2FGG144I
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View Datasheet →A3P250-2FGG144I
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View Datasheet →A3P600L-1FGG144
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View Datasheet →A3P1000L-1FGG144
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View Datasheet →A3P400-2FGG144 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 403000 |
| User I/Os | 97 |
| Embedded SRAM | 55296 bits (true dual-port) |
| Package | 144-LBGA (FGG144) |
| Programming Technology | Nonvolatile Flash |
| Process Technology | 130 nm, 7-layer metal (6 copper) CMOS |
| Live at Power-Up | LAPU Level 0 |
| Configuration | Single-chip, no external boot ROM |
| Soft Processor Support | Optional soft ARM support |
| I/O Banks | 4 (independent VCCIBx supplies) |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Mounting Type | Surface Mount |
| RoHS Status | Lead free (per Kynix listing) |
| Speed Grade | -2 |
A3P400-2FGG144 144-lbga (fgg144) Pin Configuration Guide
Complete pinout information for A3P400-2FGG144 (144-lbga (fgg144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P400-2FGG144.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P400-2FGG144 is suitable for 6 applications: Industrial Control and Automation, Secure Embedded Systems, Battery-Powered Portable Instrumentation, Bridge and Glue Logic Replacement, Power-Up-Critical Control Sequencing, Communications Line-Card and Interface Processing.
Industrial Control and Automation
The A3P400-2FGG144 fits industrial PLC I/O modules, motor control interfaces, and factory automation boards that need flexible glue logic with deterministic power-up behavior. Its 97 user I/Os across 4 independently supplied banks accept mixed-voltage signals (for example, 3.3V sensors and 2.5V backplane logic) without level shifters, and the flash fabric retains its configuration through brownouts, avoiding reconfiguration delays after power dips common on factory floors. Implemented between sensor connectors and a host processor, the FPGA aggregates, debounces, and pre-processes I/O; the 55,296 bits of true dual-port SRAM buffer data between domains. Its single-chip, no-boot-ROM design also raises overall line availability, and the 144-ball BGA footprint supports compact DIN-rail module layouts.
Recommended
Secure Embedded Systems
For security-sensitive designs such as authentication boards, secure key storage front ends, and anti-tamper controllers, the A3P400-2FGG144 offers a structural advantage: configuration resides in on-chip flash, so no bitstream traverses an external bus during boot, closing the configuration-intercept window exploited on SRAM FPGAs. LAPU Level 0 means logic is active within microseconds of power application, enabling the FPGA to gate access to other components before a host processor completes reset. Designers typically implement bus monitoring, challenge-response interfaces, and flash-memory access control in the 403K-gate fabric, using the 55,296-bit dual-port SRAM for session buffers. The single-chip solution removes the external PROM that would otherwise be a probing point, per Microchip ProASIC3 security positioning in datasheet DS50003269.
Recommended
Battery-Powered Portable Instrumentation
Handheld meters, portable data loggers, and field instruments benefit from the ProASIC3 flash fabric's low static behavior and instant-on operation. Because the A3P400-2FGG144 requires no external configuration device, board area and boot energy are saved, and the instrument can begin acquiring measurements immediately when a trigger or probe is connected rather than after a multi-hundred-millisecond bitstream load. Designers place the FPGA between analog front-end circuits and a low-power MCU, using the flash fabric for timing generation, threshold detection, and interface conversion across its 97 I/Os, with I/O banks set to the front-end voltage to avoid level shifters. The 144-ball FGG144 package, roughly square and compact, suits dense handheld PCBs; the low-power A3P400L-class variants provide further power optimization paths within compatible tooling.
Recommended
Bridge and Glue Logic Replacement
The A3P400-2FGG144 is a natural replacement for obsolete bus-interface ASSPs, legacy bridge ASICs, and boards full of 7400-series glue logic. Its 403,000-gate flash fabric absorbs address decoders, bus width converters, protocol translators, and interrupt controllers in one reprogrammable device, and because the design file is editable, late ECOs no longer require board respins. The 97 user I/Os with 4 voltage banks let one chip span a 5V-tolerant-typed legacy bus on one side and a 2.5V or 3.3V processor bus on the other, with bank supplies configured to match each domain. Live at Power-Up Level 0 operation ensures decoded chip selects are valid from the first microsecond, which matters for processors that drive bus cycles immediately after reset release.
Recommended
Power-Up-Critical Control Sequencing
Systems that must control or monitor power rails from the first milliseconds, such as backplane managers, baseband boards, and avionic-style controllers, rely on the A3P400-2FGG144's LAPU Level 0 behavior. The FPGA is functional roughly as fast as its internal flash stabilizes, so it can sequence enable pins, monitor power-good signals, and hold a processor in reset while rails stabilize, all without waiting for a bitstream download. Engineers implement multi-rail sequencers with fault latching in the flash fabric, using the 55,296 bits of dual-port SRAM to log fault events for host retrieval. Compared with a CPLD-plus-supervisor chipset, one ProASIC3 device covers sequencing logic and post-fault housekeeping, and the 144-ball BGA provides enough I/O to monitor more than a dozen rails with margin, per the ProASIC3 datasheet LAPU specification.
Recommended
Communications Line-Card and Interface Processing
Line cards, backplane adapters, and communication interface boards use the A3P400-2FGG144 for framing, multiplexing, and status aggregation between PHY devices and higher-layer processors. The 97 user I/Os accommodate parallel PHY interfaces, LED/status buses, and management links simultaneously, with the 4 I/O banks mapped to the differing voltage domains typical of mixed 2.5V/3.3V telecom boards. The 55,296 bits of true dual-port SRAM implement FIFOs and elastic buffers between clock domains, a frequent requirement when crossing system and line timing. Because the device is field-reprogrammable, interface firmware updates can be shipped as design images without board changes. Per the Microchip migration application note, I/O banks are consistently organized across A3P400, A3P600, and A3P1000, so a design can scale density upward on the identical FGG144 footprint as channel counts grow.
Recommended
Recommended Products Summary
Engineering reference data for A3P400-2FGG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-2FGG144 | A3P250-2FGG144 | A3P1000-2FGG144 | A3P600L-1FGG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FGG144) | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 403000 | ~600000 | ~250000 | ~1000000 | ~600000 |
| Family / Fabric | ProASIC3 flash | ProASIC3 flash | ProASIC3 flash | ProASIC3 flash | ProASIC3L flash (low power) |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) |
| Live at Power-Up | LAPU Level 0 | LAPU supported | LAPU supported | LAPU supported | LAPU supported |
| Programming / Configuration | Nonvolatile flash, single-chip, no boot ROM | Nonvolatile flash, single-chip | Nonvolatile flash, single-chip | Nonvolatile flash, single-chip | Nonvolatile flash, single-chip |
| Relative Unit Price (qty 1, as of 2026-08-31) | $47.59 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Instant-on single-chip flash configuration (vs SRAM-based FPGAs of similar density (external boot PROM required))
- Pin-compatible density scaling (vs A3P600-2FGG144)
- Cost-optimized density point (vs A3P1000-2FGG144)
- Low-power variant availability (vs A3P600L-1FGG144)
Design Notes
The 144-ball FGG144 BGA requires a controlled PCB stack-up with via-in-pad or dog-bone fanout on 0.8 mm (or finer) ball pitch. Plan power delivery with dedicated planes for the core supply and each of the 4 I/O bank VCCIBx rails, placing a 0.1 uF ceramic decoupling capacitor within a few millimeters of each bank supply pair, plus bulk capacitance at the board entry. Follow the Microchip ProASIC3 PCB layout guidelines in the family datasheet and reference designs for ball-map breakout patterns to keep escape routing symmetrical.
I/O bank planning is a power-domain decision: only I/O standards with compatible voltage levels may share one VCCIBx bank, per the Microchip migration application note for A3P400-class devices. Before running place-and-route in Libero SoC, tabulate every external interface (MCU bus, PHY, connector) by voltage standard and assign banks accordingly; rework after pin lock is costly. Estimated: budget bank current as sum of simultaneous switching I/O times load charge, and verify against the datasheet supply-current tables rather than assuming worst-case values.
LAPU Level 0 means user logic is live almost immediately at power application, so input pins are driven before board rails fully settle; add external pull resistors on critical FPGA inputs so board-level behavior is defined during brownout. Also, do not assume SRAM-FPGA design habits: there is no configuration PROM to re-image, so field upgrades require in-system flash programming access (JTAG or designated programming pins) that must be routed and kept accessible on the PCB. Verify ProASIC3-specific timing with Libero static timing analysis at the -2 speed grade rather than reusing -1 numbers.
Compliance Information
Kynix lists A3P400-2FGG144 as LEAD FREE. DigiKey categorizes the part within its RoHS-compliant FPGA catalog. Full REACH and halogen-free status not stated in provided data.
