A3P400-2FGG144 vs A3P600-2FGG144 Comparación
Comparación detallada lado a lado de A3P400-2FGG144 por Microchip Technology y A3P600-2FGG144 por Microsemi. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P400-2FGG144 - ProASIC3 Flash FPGA 97 I/O | Microchip
A3P400-2FGG144 ✓ Activo
Comparación de especificaciones
| Parámetro | A3P400-2FGG144 | A3P600-2FGG144 |
|---|---|---|
| Marca | Microchip Technology | Microsemi |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $40,20 | $30,40 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 403000 | — |
| User I/Os | 97 | — |
| Embedded SRAM | 55296 bits (true dual-port) | — |
| Encapsulado | 144-LBGA (FGG144) | 144-Ball FBGA (FGG144) |
| Programming Technology | Nonvolatile Flash | — |
| Process Technology | 130 nm, 7-layer metal (6 copper) CMOS | 130 nm CMOS |
| Live at Power-Up | LAPU Level 0 | — |
| Configuration | Single-chip, no external boot ROM | Single-chip, Instant On, no external boot device |
| Soft Processor Support | Optional soft ARM support | — |
| I/O Banks | 4 (independent VCCIBx supplies) | 4 (independently supplied VCCIB banks) |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Tensión de alimentación | [DATA_NEEDED: core supply voltage] | — |
| Estado RoHS | Lead free (per Kynix listing) | [DATA_NEEDED: RoHS status] |
| Speed Grade | -2 | -2 |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |