A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
MPN: A3PE3000L-FG484I ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
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Drop-in alternatives for A3PE3000L-FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-1FGG484I
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$104.5 / Unit
View Datasheet →A3PE3000L-FGG484I
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View Datasheet →A3PE3000L-FG484
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$112 / Unit
View Datasheet →A3PE3000L-1FG484I
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$89.9 / Unit
View Datasheet →A3PE3000-FGG484
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-FG484
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-FG484I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 (3.00E6) |
| Logic Cells (DFFs) | 75264 |
| User I/O (this package) | 341 |
| Max User I/O (family) | 616 |
| Embedded SRAM | 504 kbit true dual-port |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Single-Chip Solution | Yes (no external configuration PROM) |
| Operating Temperature | -40C to +100C (TJ, industrial) |
| Package | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
| Logic Family | CMOS |
A3PE3000L-FG484I 484-ball fbga (23x23 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for A3PE3000L-FG484I (484-ball fbga (23x23 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FG484I is suitable for 6 applications: Industrial Automation Control, Secure Communications Equipment, Aerospace and Defense Systems, Test and Measurement Instrumentation, Medical Device Control Logic, Battery-Powered Embedded Systems.
Industrial Automation Control
The A3PE3000L-FG484I fits industrial automation controllers where deterministic, instant-on logic must run the moment power is applied, with no configuration load time. Its 3 million gates and 75264 DFFs absorb motor sequencing, safety interlock and protocol-bridge logic, while 504 kbit of true dual-port SRAM buffers fieldbus frames. The industrial -40C to +100C (TJ) rating survives cabinet temperature swings, and the 1.2 V core keeps convection-cooled enclosures within thermal budget. Unlike SRAM FPGAs, the flash configuration needs no external PROM, improving reliability in single-chip PLC and I/O-module designs.
Recommended
Secure Communications Equipment
Flash-based FPGAs are the default choice for secure radios and encrypted links because the bitstream never leaves the chip: the A3PE3000L-FG484I stores configuration in on-chip flash with flash-lock security, eliminating the configuration-stream snooping risk of SRAM FPGAs. The 3M-gate fabric implements AES/DES cores and bus encryption, while 341 user I/O supports multiple parallel and serial interface banks in the 484-ball FBGA. Live-at-Power-Up Level 0 operation means links re-establish instantly after power interruptions, and the -40C to +100C industrial grade covers outdoor and vehicular communication cabinets.
Recommended
Aerospace and Defense Systems
The A3PE3000L-FG484I suits avionics and defense subsystems that need single-event-mitigated, low-power programmable logic with guaranteed instant-on behavior. Flash cells are inherently more SEU-tolerant for configuration storage than SRAM, reducing scrubbing overhead. With a 1.14 V to 1.575 V core range and low static power, the part fits power-constrained platforms, while the industrial -40C to +100C rating supports unheated compartments. The 484-ball FBGA with 1 mm pitch provides 341 I/O for sensor buses, ARINC-style parallel interfaces and redundant control channels within a 23x23 mm footprint.
Recommended
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000L-FG484I as trigger engines, timing generators and bus bridges, where 75264 flip-flops provide deep counter and state-machine resources and 504 kbit dual-port SRAM implements capture FIFOs. The flash fabric powers up with the instrument, removing boot delay at power-on self-test. Multiple I/O standards on the 341 user pins let one device interface to both legacy 5 V-tolerant style front ends and modern low-voltage digital buses. Low 1.2 V core operation keeps the internal supply rail simple alongside 3.3 V I/O rails in a mixed-signal instrument chassis.
Recommended
Medical Device Control Logic
Portable and benchtop medical devices benefit from the A3PE3000L-FG484I's low static power and instant-on flash configuration: patient-interface logic, sensor timing and safety monitors are active immediately when the device is switched on. The single-chip solution removes the external configuration PROM, a failure point and board area cost in compact medical hardware. 3 million gates consolidate glue logic, motor control sequencing and display interface functions, and the -40C to +100C TJ range covers autoclave-adjacent and cold-storage environments. Nonvolatile flash lock also supports design IP protection required by device manufacturers.
Recommended
Battery-Powered Embedded Systems
The ProASIC3L family exists specifically for low-power battery and energy-harvesting designs: the A3PE3000L-FG484I runs a 1.2 V core (1.14 V to 1.575 V range) with reduced static and dynamic power versus the 1.5 V ProASIC3E, extending battery life in duty-cycled systems. Because configuration is nonvolatile, the FPGA can enter deep sleep and resume instantly without reconfiguration energy - a key advantage over SRAM FPGAs that must reload their bitstream at every wake-up. The 341 available I/O in the 484-ball FBGA consolidates sensor, display and radio interfaces into one always-ready programmable device.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG484I | A3PE3000L-FGG484I | A3PE3000-FGG484 | A3PE3000-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (23x23 mm, 1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology (formerly Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Voltage | 1.2 V (1.14 V - 1.575 V) | 1.2 V (1.14 V - 1.575 V) | 1.2 V (1.14 V - 1.575 V) | 1.5 V | 1.5 V |
| Temperature Grade | Industrial -40C to +100C (TJ) | Industrial -40C to +100C | Industrial -40C to +100C | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Rating | Standard grade | -1 (relaxed) | Standard grade | 231 MHz class (ProASIC3E) | 231 MHz class (ProASIC3E) |
| User I/O (484 package) | 341 | 341 | 341 | [DATA_NEEDED] | [DATA_NEEDED] |
| Configuration / Security | On-chip flash, Live-at-Power-Up Level 0, flash lock | Same flash-based, single-chip | Same flash-based, single-chip | Same flash-based, single-chip | Same flash-based, single-chip |
Key Differentiators
- Lower core power than the ProASIC3E equivalent (vs A3PE3000-FG484)
- Cost-optimized speed grade option (vs A3PE3000L-FGG484I)
- Industrial temperature qualification (vs A3PE3000L-FG484)
Design Notes
Estimated: power-budget the three rails separately - VMON/core at 1.2 V (permitted 1.14 V to 1.575 V), VDDI/auxiliary, and VDDI/O banks at 2.5 V or 3.3 V. At 3M gates, dynamic power scales with toggle rate, so run Microchip Libero SmartPower on the compiled netlist before fixing the core regulator rating; static power at 1.2 V is far lower than the 1.5 V A3PE3000E equivalent. Use SmartPower-reported worst-case current, not gate-count estimates, when sizing the 1.2 V DC-DC converter.
The 484-ball FBGA is a 1 mm pitch, 23x23 mm BGA: design an expandable fanout (via-in-pad or dog-bone) on at least 6 layers, and dedicate the central ball region to power/ground per Microchip's package pinout tables. Place 100 nF ceramic decoupling on every VDD/VDDI ball group plus bulk capacitance at the board entry. Because this is a flash FPGA, no configuration PROM routing is needed - but route JTAG and flash-lock programming access for in-system updates.
Do not mix the commercial (no I suffix) and industrial (I suffix) grades across a BOM without re-qualifying: A3PE3000L-FG484 (commercial) drops in on the same footprint but is not rated -40C to +100C. Also remember that although the family supports up to 616 user I/O, this 484-ball package exposes only 341 - over-allocating I/O in HDL will fail place-and-route. Re-run timing closure in Libero after any speed-grade migration (e.g., to -1 parts).
Compliance Information
ROHS3 Compliant per Microchip USA product listing for the A3PE3000L-FGG484I family. REACH, halogen-free and conflict-minerals statuses not stated in the provided data.
