BSC9131NSE7KHKB vs BSC9131NJN1HHHB557 Comparison
Detailed side-by-side comparison of BSC9131NSE7KHKB by NXP Semiconductors and BSC9131NJN1HHHB557 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | BSC9131NSE7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | Microcontrollers |
| Lifecycle Status | Active | Active |
| Processor Type | QorIQ Qonverge SoC | QorIQ Qonverge multicore baseband processor |
| CPU Core | 1 core, 32-bit e500 PowerPC | — |
| CPU Frequency | 1 GHz | — |
| DSP Engine | 1 GHz StarCore DSP | — |
| Accelerator | MAPLE-B2F | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Architecture | 32-bit | — |
| Memory Support | DDR3 | — |
| Interface | IFC | — |
| Security Feature | SEC | — |
| Operating Temperature Range | 0 °C to +105 °C | [DATA_NEEDED: operating temperature range] |
| Package | 520-FCBGA | — |
| Package Dimensions | 21 mm × 21 mm | — |
| Mounting Type | Surface mount | Surface Mount |
| Processor Category | Microprocessor IC | Embedded MPU / communications processor |
| Supplier Price | $54.9669 per unit as of 2026-10-23 | — |
| Reported Supplier Stock | 5,760 pieces | — |
| Lead Time | To be confirmed | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Thermal Resistance | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Lifecycle Status | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |