BSC9131NSE7KHKB vs BSC9131NJN1HHHB557 Vergleich
Detaillierter Direktvergleich von BSC9131NSE7KHKB von NXP Semiconductors und BSC9131NJN1HHHB557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | BSC9131NSE7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Processor Type | QorIQ Qonverge SoC | QorIQ Qonverge multicore baseband processor |
| CPU Core | 1 core, 32-bit e500 PowerPC | — |
| CPU Frequency | 1 GHz | — |
| DSP Engine | 1 GHz StarCore DSP | — |
| Accelerator | MAPLE-B2F | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Architecture | 32-bit | — |
| Memory Support | DDR3 | — |
| Schnittstelle | IFC | — |
| Security Feature | SEC | — |
| Betriebstemperaturbereich | 0 °C to +105 °C | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 520-FCBGA | — |
| Package Dimensions | 21 mm × 21 mm | — |
| Montageart | Surface mount | Surface Mount |
| Processor Category | Microprocessor IC | Embedded MPU / communications processor |
| Supplier Price | $54.9669 per unit as of 2026-10-23 | — |
| Reported Supplier Stock | 5,760 pieces | — |
| Lead Time | To be confirmed | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Wärmewiderstand | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Lebenszyklusstatus | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |