BSC9131NSE7KHKB vs BSC9131NJN1HHHB557 Сравнение
Подробное сравнение бок о бок BSC9131NSE7KHKB от NXP Semiconductors и BSC9131NJN1HHHB557 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | BSC9131NSE7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | DSP | Microcontrollers |
| Статус жизненного цикла | Активен | Активен |
| Processor Type | QorIQ Qonverge SoC | QorIQ Qonverge multicore baseband processor |
| CPU Core | 1 core, 32-bit e500 PowerPC | — |
| CPU Frequency | 1 GHz | — |
| DSP Engine | 1 GHz StarCore DSP | — |
| Accelerator | MAPLE-B2F | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Architecture | 32-bit | — |
| Memory Support | DDR3 | — |
| Интерфейс | IFC | — |
| Security Feature | SEC | — |
| Диапазон рабочих температур | 0 °C to +105 °C | [DATA_NEEDED: operating temperature range] |
| Корпус | 520-FCBGA | — |
| Package Dimensions | 21 mm × 21 mm | — |
| Тип монтажа | Surface mount | Surface Mount |
| Processor Category | Microprocessor IC | Embedded MPU / communications processor |
| Supplier Price | $54.9669 per unit as of 2026-10-23 | — |
| Reported Supplier Stock | 5,760 pieces | — |
| Lead Time | To be confirmed | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Тепловое сопротивление | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Статус жизненного цикла | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |